Used SMT Equipment | In-Circuit Testers
JDSU RSAM-5800B The RSAM-5800XT Remote Service Analyzer Module provides remote RF and MPEG monitoring and analysis of forward path signals and is ideal for remote, unmanned hub sites or headends. Users see detailed views of channel performance fr
Used SMT Equipment | In-Circuit Testers
JDSU RSAM-5800B The RSAM-5800XT Remote Service Analyzer Module provides remote RF and MPEG monitoring and analysis of forward path signals and is ideal for remote, unmanned hub sites or headends. Users see detailed views of channel performance fr
Industry News | 2021-05-19 22:36:33.0
Calibration is the process of configuring an instrument to provide a result for a sample within an acceptable range. This process eliminated or minimized factors that cause inaccurate measurements. Although the exact procedure may vary from product to product, the calibration process generally involves using calibration instrument to test samples of one or more known values called "calibrators". The results are then used to establish a relationship between the measurement technique used by the instrument and the known values. The process in essence "teaches" the instrument to produce results that are more accurate than those that occur otherwise. The instrument can then provide more accurate results when samples of unknown values are tested in the normal usage of the product.
Industry News | 2016-10-20 05:38:17.0
The app allows you to manage traditional air conditioners that are controlled through infrared remotes. Designed for the office environment, the app relies on the ambient brightness (measured by Tibbit #28) to determine whether the aircon should be running or not. In the office setting, no lights = no people = no need for the aircon to work.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Electronics Forum | Sat Jun 21 11:00:32 EDT 2008 | 1036
We recently bought an used MPM SPM screen printer. The system can not boot up correctly and terminates the program finally. During the computer booting up, I can see error massages "mouse could not be found", "abnormal program terminated", "trap 0".
Electronics Forum | Sun Dec 22 06:00:54 EST 2002 | Mark
Hi: Your stencil specs are good; Did you check the stencil thickness? It would be worth a ck since there may be an error from the stencil mfr If the paste is not releasing with good stencil specs, these are possible causes: 1 The paste isn't tou
Electronics Forum | Thu Dec 13 10:39:38 EST 2007 | lloyd
Hi Mefunak, I'd say that the vacuum holding circuit is at fault. If the component is picked OK from the feeder ('vacuum check after pickup' is switched on) then the component is being dropped from the head as the gantry moves to the placement positi
Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette
This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha
