Electronics Forum | Sat Jul 11 03:01:29 EDT 2020 | researchmfg
The bubble inside BGA ball locate at via in pad and apply the resin plug hole.You shall check the cooper plating quality on PCB pad. If there is thin plating or broken on the pad then air will come from the resin plugged via and be trapped inside the
Electronics Forum | Thu May 04 13:20:55 EDT 2023 | tommy_magyar
We do the same as dontfeedphils, with the difference being that it goes through a drying program too after stencil wash program (3 mins @ 90 degrees air spray) to dry out the via holes and any trapped liquid from under the components.
Electronics Forum | Wed Apr 21 14:29:58 EDT 1999 | joe devaney
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
Electronics Forum | Tue Aug 21 03:42:55 EDT 2001 | mugen
SMT community, My Fellows, 1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? 2) why is water-soluble (WS) not a hot choice? 3) All I know, *is in layman terms*, that BGA has tendency to trap water, should WS process be the c
Electronics Forum | Mon Mar 07 10:14:31 EST 2005 | jmedernach
Cellular and PDA architectures employ this technology all the time. You have to be careful with your board supplier as well as with your plugging approach. Leave the via unplugged, I guarantee voids in the solder joint. That leaves us with, "how d
Electronics Forum | Tue Jan 03 17:36:49 EST 2006 | MikeF
If you know you have cleaned any flux residues that were under there you could consider a bead of an electronic grade RTV, such as RTV3145. If you trap any uncleaned residues under there you could have long term reliability problems. But, like Dave
Electronics Forum | Fri May 12 06:13:55 EDT 2006 | slaine
Hi I use a lot of preforms for other specific applications. Personally I like indiums product but the lead time is awful and dont often deliver them on schedule. (im in the uk). Some manufactures make preforms out of solder wire that is pressed flat
Electronics Forum | Wed Apr 04 19:10:20 EDT 2007 | rgduval
Pete, Top-side temp might be an issue. What's the easiest way to check it? I seem to recall some thermal decals that we used to use a couple of jobs ago. I spoke with the flex manufacturer, and they recommended 4 hours at 250 degrees pre-process
Electronics Forum | Thu Jun 11 10:02:36 EDT 2009 | dyoungquist
Our cleaning process involves the assemblies being completely immersed in the water bath of the ultrasonic cleaner. The assembly has a QFP44 on it. Customer stated that when these assemblies have been cleaned with water in the past (at a different
Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef
Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as
