Used SMT Equipment | In-Circuit Testers
JDSU OLT55-2286/02 OLT-55 Optical Loss Test Set, integrated Laser source: wavelength 1310 and 1550 nm, power range -7 to 0 dBm, Fiber style 9/125 m SM, integrated Power meter: wavelength range 780 to 1650nm, power range -70 to +20 dBm, Ge photodi
Used SMT Equipment | In-Circuit Testers
JDSU OLT55-2286/02 OLT-55 Optical Loss Test Set, integrated Laser source: wavelength 1310 and 1550 nm, power range -7 to 0 dBm, Fiber style 9/125 m SM, integrated Power meter: wavelength range 780 to 1650nm, power range -70 to +20 dBm, Ge photodi
Used SMT Equipment | In-Circuit Testers
JDSU OLT55-2286/01 Details JDSU OLT55-2286/01 OLT-55 Optical Loss Test Set, integrated Laser source: wavelength 1310 and 1550 nm, power range -7 to 0 dBm, Fiber style 9/125 m SM, integrated Power meter: wavelength range 780 to 1650nm, power ra
New Equipment | Cleaning Equipment
AF04 Cleans condensation traps, solder frames and carriers The kolb AF04 is a three chamber system which enables short cycle times. The system is therefore capable within a short time of parallel process cleaning, rinsing and drying. It cl
Industry News | 2017-05-22 17:36:43.0
KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum. Bixenman will present the paper entitled, “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach” at 2:30 p.m. on Wednesday, June 7, 2017 at the Edward Village Markham in Ontario.
Rugged Material Feeding Unit for Highly Abrasive Dispensing Media With High Viscosity. Loading of Material From 20-Litre Drums With the Patented Scheugenpflug Barrel Follower Plate. The barrel (hobbock, pail) is positioned on the ergonomic hobbock d
Technical Library | 2015-07-16 17:24:23.0
Qualification of electronic hardware from a corrosion resistance standpoint has traditionally relied on stressing the hardware in a variety of environments. Before the development of tests based on mixed flowing gas (MFG), hardware was typically exposed to temperature-humidity cycling. In the pre-1980s era, component feature sizes were relatively large. Corrosion, while it did occur, did not in general degrade reliability. There were rare instances of the data center environments releasing corrosive gases and corroding hardware. One that got a lot of publicity was the corrosion by sulfur-bearing gases given off by data center carpeting. More often, corrosion was due to corrosive flux residues left on as-manufactured printed circuit boards (PCBs) that led to ion migration induced electrical shorting. Ion migration induced failures also occurred inside the PCBs due to poor laminate quality and moisture trapped in the laminate layers.
Technical Library | 2016-12-29 15:37:51.0
The reliabilities of the flux residue of electronic assemblies and semiconductor packages are attracting more and more attention with the adoption of no-clean fluxes by majority of the industry. In recent years, the concern of "partially activated" flux residue and their influence on reliability have been significantly raised due to the miniaturization along with high density design trend, selective soldering process adoption, and the expanded use of pallets in wave soldering process. When flux residue becomes trapped under low stand-off devices, pallets or unsoldered areas (e.g. selective process), it may contain unevaporated solvent, "live" activators and metal complex intermediates with different chemical composition and concentration levels depending on the thermal profiles. These partially-activated residues can directly impact the corrosion, surface insulation and electrochemical migration of the final assembly. In this study, a few application tests were developed internally to understand this issue. Two traditional liquid flux and two newly developed fluxes were selected to build up the basic models. The preliminary results also provide a scientific approach to design highly reliable products with the goal to minimize the reliability risk for the complex PCB designs and assembly processes. This paper was originally published by SMTA in the Proceedings of SMTA International
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
