Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Industry News | 2011-10-28 20:59:38.0
Seika Machinery announces that an independent lab has confirmed that its Solder Paste Recycling (SPR) machine is capable of producing pure solder ingots from solder paste.
EMST Stallion PLC TT-JW is a new table top wave soldering machine from EMS Technologies, the soldering specialists. After the world wide success of the previous table top model, EMST Stallion, it is upgraded from manual controls to PLC based control
New Equipment | Solder Paste Stencils
PNC Inc. uses LPKF Laser Technology to manufacture SMT Solder paste stencil, high tolerance aperture openings with superior registration for it’s solder paste stencils. With it’s 4 mil beam diameter, our Laser is capable of cutting small aperture ope
Industry News | 2007-11-01 20:23:59.0
Farnborough, UK -November 2, 2007� BTU Europe, a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy generation markets, announces it will launch the Pyramax 100 range in hall A4, booth 141 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2023-01-09 18:17:22.0
Transition Automation, Inc. is pleased to announce the release of a new "Slim-Line Tool Free" Squeegee Holder System at this year's IPC APEX EXPO Trade Show in booth #3325. The new holder design is aptly named SlimLine to highlight the flat front surface and lack of screws or clamp bar features. This new holder design is our first "tool free" holder that allows for blade changes without the use of screwdrivers, nut wrenches or other tools. The new design incorporates magnets to secure the main body of the squeegee blade and unique end "locks" that have a very low profile. The result is a holder that provides a complete smooth front blade surface. The benefit of this design is that the squeegee blade does not have any protruding elements that typically interfere with solder paste rolling. Clamp bars, screws and hardware located in the front of the squeegee cause interruption and difficulty when maintaining squeegees. Screws get clogged with dried solder paste and paste will stick on any protruding surface. By eliminating these protruding elements, this new squeegee holder improves print quality and cleaning ability. Now, users can simply swipe across the front squeegee and obtain complete cleaning with a smooth spatula. This design is available for all SMT printers and maintains similar design outline as previous Transition Automation holder geometries. Another goal of the new design is to minimize interstitial spaces where cleaning fluid and paste can be trapped.
Industry News | 2009-05-29 10:09:26.0
NASHVILLE � May 2009 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman will present at the upcoming SMTA Upper Midwest Expo & Tech Forum.
Industry News | 2009-05-29 10:21:44.0
Garden Grove, CA � May 2009 � Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, is pleased to announce the addition of the new Easy Flow Blue Piston to the 700 Series Premier Dispensing Product Line.
