Industry Directory | Manufacturer
The international full service manufacturer of systems, detergents, equipment and process design for the cleaning in electronics production.
The pressure meter comes in the same available formats as the pH meters in either a DIN box or a bright polish finished IP65 rated desktop enclosure. The meter can be connected to either one or two pressure flow cells at one time. The flow cell desig
The best stability under all operating conditions is achieved by electrical rotary equipment (motors and generators) and static electrical equipment (transformers and sensors) if all the air trapped inside the wire windings is replaced with insulatio
Electronics Forum | Wed Sep 29 09:29:47 EDT 2010 | swag
Take a few parts from the reel and look close at the parts to make sure the bottom surface of the leads is below the bottom surface of the body.
Electronics Forum | Wed Sep 29 08:26:03 EDT 2010 | babe7362000
We are Currently running a Board and it seems that the SOT-223's on the bottom side have flux and water trapped under the part. Nothing has changed in our process and this is the only board that it is happening on. We are using Kester R562 water wa
Used SMT Equipment | Soldering - Reflow
BTU Pyramax 125N Parameters Pyramax Specifications Model Pyramax 125N Atmosphere Air or Nitrogen Conveyor Speed 10-60 in/min 25-152 cm/min Conveyor Width 2-18 in 51-457 mm Heated Length 125 in 3175 mm Heated Zones&
Used SMT Equipment | In-Circuit Testers
JDSU RSAM-5800B The RSAM-5800XT Remote Service Analyzer Module provides remote RF and MPEG monitoring and analysis of forward path signals and is ideal for remote, unmanned hub sites or headends. Users see detailed views of channel performance fr
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
Industry News | 2012-02-15 19:18:44.0
GPD Global announces that its PCD4H Dispense Pump yields excellent results with phosphor and non-phosphor-filled LED encapsulation as viewed on the color chart by tightly grouped results.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-09-23 22:25:12.0
Moisture trapped within components and PBs presents a serious problem during the fabrication and assembly process. Too much moisture can lead to board failures when it is turned to steam during the reflow process.
AF04 Cleans condensation traps, solder frames and carriers The kolb AF04 is a three chamber system which enables short cycle times. The system is therefore capable within a short time of parallel process cleaning, rinsing and drying. It cl
VIGON® RC 303 is a water-based cleaning agent specifically developed to remove all types of baked-on flux residues from reflow ovens and wave solder systems. Also, it removes re-condensed fluxes and emissions from condensation traps and heat exchange
SMTnet Express, July 20, 2017, Subscribers: 30,612, Companies: 10,637, Users: 23,528 Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components Bruno Tolla, Ph.D., Jennifer Allen, Kyle Loomis - Kester Corporation , Mike
| http://etasmt.com/cc?ID=te_news_bulletin,23577&url=_print
. Trapped gas bubbles increase in size as pressure is reduced Larger bubbles are more likely to collide with other bubbles and ultimately collide with the edge of liquid solder to escape Larger bubbles
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/bubbles-and-conformal-coating
Bubbles occur when solvents or air become trapped and can’t escape conformal coating material. The presence of bubbles can lead to long-term product reliability issues including bridging of conductive paths, corrosion of exposed areas, and cracked coating due to temperature changes, shock or vibration
