VIGON® RC 303 is a water-based cleaning agent specifically developed to remove all types of baked-on flux residues from reflow ovens and wave solder systems. Also, it removes re-condensed fluxes and emissions from condensation traps and heat exchange
ATRON® SP 200 is a water-alkaline surfactant cleaner, specifically developed to remove baked-on fluxes from solder pallets and condensation traps. ATRON® SP 200 can be used for the removal of unsoldered solder pastes from SMT stencils. The cleaner ca
New Equipment | Cleaning Equipment
AF03 Small two chamber desktop system for solder frames and condensation traps With AF03 kolb has created a system with a great cost / value ratio that can be called a "clean" alternative for small manufacturers, where the
New Equipment | Cleaning Equipment
Ultrasonic Stencil and Misprint Cleaning Systems Cleaning at the Speed of Sound Ultrasonic - Effective - Safe StencilWasher harnesses the power of sound waves to effectively remove raw solder paste and uncured adhesives from stencils, screens, and
Industry News | 2016-09-07 18:44:03.0
KYZEN announces that Dr. Mike Bixenman will present the recent paper entitled, “Reactivity of No-Clean Flux Residues Trapped Under Bottom Terminated Components” during SMTA International. The paper is co-authored by Bruno Tolla, Ph.D., Jennifer Allen and Kyle Loomis from Kester and will be presented during the “Flux, Solder, Adhesives Track” on Tuesday, September 27, 2016 at 3 p.m.
Used SMT Equipment | Soldering - Reflow
BTU Pyramax 125N Parameters Pyramax Specifications Model Pyramax 125N Atmosphere Air or Nitrogen Conveyor Speed 10-60 in/min 25-152 cm/min Conveyor Width 2-18 in 51-457 mm Heated Length 125 in 3175 mm Heated Zones&
Used SMT Equipment | In-Circuit Testers
JDSU RSAM-5800B The RSAM-5800XT Remote Service Analyzer Module provides remote RF and MPEG monitoring and analysis of forward path signals and is ideal for remote, unmanned hub sites or headends. Users see detailed views of channel performance fr
Used SMT Equipment | In-Circuit Testers
JDSU RSAM-5800B The RSAM-5800XT Remote Service Analyzer Module provides remote RF and MPEG monitoring and analysis of forward path signals and is ideal for remote, unmanned hub sites or headends. Users see detailed views of channel performance fr
This video describes the features of BTU's Pyramax™ convection reflow oven, including the new dual-lane, dual-speed feature which essentially gives one oven the capability of two ovens. Pyramax ovens are known worldwide for superior reliability, unm
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
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