Industry Directory | Manufacturer
Global vision module system for visual inspection of chip components cosmetic defect to the Electronics Manufacturing Industry. 20 years experience in design, develop and manufacturing, customize lighting, optic, and algorithms.
Industry Directory | Consultant / Service Provider
SPC software manufacturer. Our software includes such extras as defect tracking, traceability, trend and root cause analysis, overall equipment effectiveness (OEE), rolled throughput yield (RTY), equipment uptime/downtime and supplier quality management in a true real-time production-based system.
New Equipment | Test Equipment
KOH YOUNG Zenith 3D AOI Ultimate Solution for Inspection Challenges Incomparable True 3D Inspection Performance IPC-based Solder Joint Inspection AI-Powered Auto Programming (KAP) KOH YOUNG Zenith 3D AOI KOH YOUNG Zenith 3D AOI The Industry’s
New Equipment | Test Equipment
KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R
Electronics Forum | Mon May 05 18:48:23 EDT 2003 | Kris
Hi, It is expected that lead-free will have reduced tomstoning. As it has a higher surface tension and does not wet as well as the tinlead paste it exibit lower tombstoning. Addiotnaly commercialy available lead-free alloys may not be true eutectic
Electronics Forum | Thu Dec 19 14:00:24 EST 2019 | kylehunter
True, but with rosin it should protect the joints pretty well right?
Used SMT Equipment | AOI / Automated Optical Inspection
Key Features Ultimate Solution for Inspection Challenges Circuit boards are becoming more complex with new products. An AOI machine is becoming even more crucial to the electronics manufacturing lines. The industry has many2D, 2.5D and pseudo
Used SMT Equipment | AOI / Automated Optical Inspection
Key Features Ultimate Solution for Inspection Challenges Circuit boards are becoming more complex with new products. An AOI machine is becoming even more crucial to the electronics manufacturing lines. The industry has many2D, 2.5D and pseudo
Industry News | 2003-04-02 09:03:49.0
Configural Recognition(TM) Object and Image-Analysis Technology Enables One-Hour Program Generation
Industry News | 2011-02-09 14:50:49.0
Manufacturing and quality engineers looking for solutions to process challenges will have an additional resource for answers with the new Process Defect Clinic at the IPC APEX EXPO conference and exhibition, April 12–14, 2011, in Las Vegas. Sponsored by IPC and the National Physical Laboratory (NPL), the free clinic will be held in booth 217 on the show floor to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Soldering Equipment/Fluxes
3D Solder Paste Inspection Machine Features : Easy to use by fully motorize X-Y scan mechanism. Easy to program by Gerber image navigator Easy to repeat the same job by loading the saved program User-friendly color image live view operation Ea
Technical Library | 2015-04-29 03:48:39.0
SPI equipment is routinely used in Printed Circuit Board (PCB) manufacturing to monitor and control one of the most crucial steps affecting the finished quality of circuit board. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry's first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process 3D inspection on the assembly line. SPI systems measure the height and volume of the solder pads before the components are applied and the solder melted, and when used properly, can reduce the incidence of solder-related defects to statistically insignificant amounts. Critical to the SPI measurement is the accuracy of the height measurement because that has a direct correlation with solder volume and defects.
Technical Library | 2008-05-28 18:41:53.0
This paper describes correlation between a true 2D area measurement (e.g. printer) and a height map generated area from a SPI system. In addition, this paper will explore the correlation between area/volume measurements and bridge detection between 2D/3D techniques. The ultimate goal is to arm the process engineers with information that can be used to make decision that will impact defects, cost, throughput and Return On Investment.
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Career Center | kanchipuram, Tamilnadu India | Engineering,Maintenance,Research and Development,Technical Support
Experiences : Solectron (Ems) India Ltd. Yalahanka New town, Bangalore, India Duration: AUG 2007 to Sep 2009 Designation: Process Technician (SMT) NOKIA India Pvt Ltd Sipcot Industrial area, Sriperambadur, Chennai, Duration: Sep 2009 to
Career Center | Hyderabad, Telangana India | Engineering,Maintenance,Production
Experience in handling Process related issues throughout the Product Manufacturability. Programming and maintenance of SMT Pick and Place Machines of Mirae, Panasonic, NXT and MyData Programming and maintenance of Solder Paste Printer of DEK
KD Electronics Ltd. | http://www.kundasmt.com/?list_31/6011.html
(KAP)KSMART Solutions: True 3D Measurement-based Process Control SystemZero-defect through AI-Powered Incomparable True 3D Inspection Performance Powerful Side-View Camera Advanced Tall Component Inspection Self-Diagnosis
| https://www.eptac.com/webinars/delamination-causes-and-cures/
. Topics we will be reviewing are: What is true delamination? How this defect occurs and how to prevent it. Review of internal and external observations. The standards
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