Technical Library | 2018-12-12 22:20:22.0
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-on-package (PoP) that offers a reduction in overall PCB board area requirements while allowing for increases in functionality. It utilizes standard, readily available device packaging methods in which high-density packaging is achieved by: (1) using standard "packaged" memory devices, (2) using standard 3-dimensional (3-D) interconnect assembly. The stacking approach provides a high level of functional integration in well-established and already functionally tested packages. The stack packages are built from TSOP packages with 48 leads, stacked either 2-high or 4-high, and integrated into a single dual-flat-no-lead (DFN) package.
Logical Systems designs and manufactures adapters for EPROM programming, prototyping and production. Off the shelf and custom solutions available.
Technical Library | 2000-11-13 20:28:58.0
Free 16 page booklet shows 200 standard SMD Daisy Chain configurations including BGA, QFP, TQFP, TSOP, SOIC, SSOP, Flat Pack, CERQUAD and more.
Used SMT Equipment | AOI / Automated Optical Inspection
Inspects down to 0402 for parts/solder checks Fine pitch QFP's and TSOPS Board Size: 2.5" x 2.5" Minimum / 12" x 12" maximum Capable of checking for missing part, solder quality, electrode lead co
Industry Directory | Consultant / Service Provider / Manufacturer / Manufacturer's Representative
Dummy Components and IC Assembly/IC Packaging Service Provider
Technical Library | 1999-05-09 12:51:38.0
This Technical Note outlines, step by step, the easiest ways to remove and replace surface mounted devices, using the lowest possible temperatures. This document discusses the following topics: Removal and replacement of discrete and passive components (capacitors, resistors, SOTs), Removal of two-sided components (SOICs, SOJs, TSOPs), Removal of quad components (PLCCs, QFPs), Replacement of quad components including fine-pitched devices.
100 different practice boards covering the entire range of SMD components: BGA, QFP, TQFP, TSOP, SOIC, discrete and chips. With fiducials. HASL and Entek available.
Accept a surface mount package and plug into a DIP socket on an EPROM programmer. Available for DIP, PLCC, QFP, SOIC, SSOP, TSOP, TSSOP and QSOP
Industry Directory | Manufacturer
Xeltek develops and manufactures universal Parallel, ISP, Production and Automated Device Programmers. Universal adapters support various package types such as PLCC, SOIC, SOP, TSOP, QFP, SDIP and uBGA.