Technical Library | 2018-12-12 22:20:22.0
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-on-package (PoP) that offers a reduction in overall PCB board area requirements while allowing for increases in functionality. It utilizes standard, readily available device packaging methods in which high-density packaging is achieved by: (1) using standard "packaged" memory devices, (2) using standard 3-dimensional (3-D) interconnect assembly. The stacking approach provides a high level of functional integration in well-established and already functionally tested packages. The stack packages are built from TSOP packages with 48 leads, stacked either 2-high or 4-high, and integrated into a single dual-flat-no-lead (DFN) package.
Logical Systems designs and manufactures adapters for EPROM programming, prototyping and production. Off the shelf and custom solutions available.
Technical Library | 2000-11-13 20:28:58.0
Free 16 page booklet shows 200 standard SMD Daisy Chain configurations including BGA, QFP, TQFP, TSOP, SOIC, SSOP, Flat Pack, CERQUAD and more.
100 different practice boards covering the entire range of SMD components: BGA, QFP, TQFP, TSOP, SOIC, discrete and chips. With fiducials. HASL and Entek available.
Accept a surface mount package and plug into a DIP socket on an EPROM programmer. Available for DIP, PLCC, QFP, SOIC, SSOP, TSOP, TSSOP and QSOP
Used SMT Equipment | AOI / Automated Optical Inspection
Inspects down to 0402 for parts/solder checks Fine pitch QFP's and TSOPS Board Size: 2.5" x 2.5" Minimum / 12" x 12" maximum Capable of checking for missing part, solder quality, electrode lead co
Industry Directory | Consultant / Service Provider / Manufacturer / Manufacturer's Representative
Dummy Components and IC Assembly/IC Packaging Service Provider
Technical Library | 1999-05-09 12:51:38.0
This Technical Note outlines, step by step, the easiest ways to remove and replace surface mounted devices, using the lowest possible temperatures. This document discusses the following topics: Removal and replacement of discrete and passive components (capacitors, resistors, SOTs), Removal of two-sided components (SOICs, SOJs, TSOPs), Removal of quad components (PLCCs, QFPs), Replacement of quad components including fine-pitched devices.
Industry Directory | Manufacturer
Xeltek develops and manufactures universal Parallel, ISP, Production and Automated Device Programmers. Universal adapters support various package types such as PLCC, SOIC, SOP, TSOP, QFP, SDIP and uBGA.
Parts & Supplies | Other Equipment
SMT Parts PANASERT Nozzle MSR PANASONIC SMT Nozzle Model PANASERT MSR For PANASERT placement machine. Uninterrupted operation Tip made by Diamond steel No.1046850017 1.The MSR multi-functional high-speed placement machine provides
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