Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
CL-1500 high precision automatic solder paste screen printer designed for high precision screen printing or stencil printing for PCBS of LED Lighting products. Support PCB size from 100mm x 50mm to 1500mm x 350mm and PCB thickness from 0.8mm to
New Equipment | Test Equipment
Using a sample boundary-scan IC, the JTAG Technologies BSDL generation/verification system automatically verifies the existing BSDL (Boundary-Scan Description Language) file or creates a BSDL file for the device if none exists, all in accordance with
New Equipment | Component Programming
7th Gen Manual Programmer with Two Sites Performance The 2710 Manual Concurrent Programming System® is designed for today’s microcontrollers with their long programming times. Used in combination with FX4™ socket modules, the 2710
New Equipment | Rework & Repair Equipment
The AT-GDP Series BGA Rework Systems are semi-automatic machines featuring the latest vision and process control technologies. Lead-Free applications consisting of complex components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s are rework
New Equipment | Assembly Services
Infineon New and Original S29JL032J70TFI320 in Stock IC TSOP-48 21+ package S29JL032J70TFI320 64Mb 3.0V Simultaneous Read/Write Parallel NOR Flash PIC18F25K22-I/SO SOP28 MICROCHIP 22+ SN74LV123ATPWRG4Q1 TSSOP16 TI 21+ sucs32405c DIP COSEL 22
Industry News | 2008-08-01 00:29:58.0
With the well-respected die attach brands of Hysol� and Ablestik�, Henkel has long been recognized for consistently pushing the bar higher when it comes to advanced semiconductor materials development. This pioneering philosophy has led to the development of yet another groundbreaking materials advance and the launch of Henkel's Ablestik 8000� Wafer Backside Coating� (WBC) technology.
Industry News | 2012-05-11 20:19:04.0
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.
Industry News | 2013-02-12 10:50:00.0
Europlacer a manufacturer of market-leading flexible SMT placement machines, debuts Project iico, a concept that combines outdated systems with new, innovative parts to result in an environmentally smart, technologically advanced assembly system.
In this video we briefly demonstrate the removal of a BGA component from a smart phone circuit board. To get a quote or obtain more information on the IR 1000, visit the link below: https://www.paceworldwide.com/products/area-array-bga-rework/bga-r
