Industry News | 2020-07-27 11:12:23.0
Columbus, Ohio - Engineered Vision announces the release of the Flex-Bot: A New Generation of Vision Flex Feeding Technology! The Flex-Bot provides a solution to a previously unsolved manufacturing dilemma of high mix part feeding. This limitation has stifled manufacturers ability to automate, leaving manual labor in charge of dull and monotonous part feeding for anything less than ultra-high volume. The Flex-Bot offers an alternative to ultra-high volume single part bowl feeders with multiple part flexibility and additional orientation capability through robotic placement. With a standard hardware and software platform, there has been a greater than 40% reduction in engineering hours required to develop a custom application, and those savings are being passed on to the customer. With the ability to quickly adapt to an immense range of parts through Vibratory & Smart Auto-Tuning Technology as well as a point and click user interface, the Flex-Bot is the solution for today's current projects and tomorrow's ambitions.
Industry News | 2024-02-05 14:03:14.0
Bentec is pleased to announce that Prey By Detech has appointed Panatek CO., a leading provider of integrated in the electronics industry, to represent the company throughout the regions of Egypt, Saudi Arabia, and the UAE. With a commitment to delivering cutting-edge manufacturing technologies and smart solutions, Panatek is poised to enhance the presence of Prey's Universal Product Inspector (UPI) in these strategic markets.
Industry News | 2019-11-27 10:27:07.0
“One-stop” expert consultation can keep semiconductor production on track through installation and beyond
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2004-12-02 12:51:22.0
USB104+ provides embedded computer systems with high speed USB transfer rates, 40 times faster than legacy USB 1.1 solutions
Industry News | 2005-02-08 15:05:16.0
Parvus to release two new rugged embedded PC/104-Plus computers designed for high-speed networking, data transfer, and bandwidth-intensive applications
Industry News | 2005-04-20 13:21:59.0
New PC/104-Plus SpacePC CPUs combine fanless -40C to +85C extended temperature operation with 256MB of soldered RAM for high reliability in mobile computing applications
Industry News | 2005-07-11 12:52:53.0
Parvus now offers low-power Intel Pentium III-based architecture in three new ruggedized PC/104-Plus CPU boards, the SpacePC 1460, 1461 and 1463
Industry News | 2005-09-12 15:55:00.0
Parvus Announces Availability of COM-1440 Module, USB 2.0 Host Controller Card with High Current Drive Capable of Powering USB Mass Storage Devices
Industry News | 2005-11-03 11:14:00.0
Parvus to transition to lead-free production of embedded PC products by July 1, 2006; Parvus to focus on reliability assurance and risk mitigation techniques with high-reliability customers
