Electronics Forum | Mon Jul 11 13:21:40 EDT 2016 | bradholland
well there you go. I found that trying different values in the "Placing Stroke" had a big effect. I changed it to 2mm and it placed them well, but I could see the board also flexing a little, went to 1mm and the problem came back, so have sat in th
Electronics Forum | Wed Sep 11 01:17:59 EDT 2002 | Brian Sloth Bentzen
Hi Steve. My Fuji CP6 is model 643 and are 3 years old, maintained and upgraded with the newest software along the way. And, actually it was Fuji Japan that gave in, not Fuji America. Fuji Japan tested our components and found the same problem and
Electronics Forum | Tue Jul 12 08:54:34 EDT 2016 | leeg
well there you go. I found that trying > different values in the "Placing Stroke" had a > big effect. I changed it to 2mm and it placed > them well, but I could see the board also flexing > a little, went to 1mm and the problem came back, > so
Electronics Forum | Thu Feb 27 11:46:47 EST 2003 | genny
We have struggled with this as well. Basically, we have a consistent rotation for all packages of the same type, but I don't think our rotation has anything to do with the actual rotation that the PnP equipment actually wants to see. I believe our
Electronics Forum | Thu Jul 15 16:15:13 EDT 1999 | Doug
| Hi, | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | Secondly, I need also f
Electronics Forum | Mon Jul 12 21:40:56 EDT 1999 | Earl Moon
| Hi, | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | Secondly, I need also f
Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo
Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof
Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 10:26:38 EDT 1999 | HST-SE
| | Hi, | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | Secondly, I n
Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin
| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |
