Eclipse Industries manufactures the ultra-high precision DS-107 Aligner Bonder, alignment to 1-2 microns, bond force 5 gm to 100 kg. Applications are flip chip, die bonding, CSP, uBGA, MCM, flat panel displays, die-to-wafer & optoelectronics.
Contract electronics design and manufacturing service provider. ISO-9002 certified and IPC Class II and III capable. Advanced SMT packages including uBGA and 0201 components. Full testing, X-ray inspection, and automated conformal coating.
New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Electronics Forum | Tue Oct 22 10:23:38 EDT 2002 | davef
ubga and stencil
Electronics Forum | Wed Feb 24 11:00:12 EST 1999 | Steve Schrader
Are the terms "uBGA" and "Fine Pitch BGA" synonomous, different all-together, or is Fine Pitch BGA a subset of uBGA? Thanks. Steve
Used SMT Equipment | Pick and Place/Feeders
Emerald -XII front FES 20 carriages Assembleon Philips Emerald Xii High accuracy flexible placement system 0201 to 54mm square or up 100mm long connectors BGA, uBGA, ICs, 0201 20MM tall parts 84 feeder inputs 2 x SF uper fine heads Front sid
Used SMT Equipment | Pick and Place/Feeders
Emerald -XII front FES 20 carriages Assembleon Philips Emerald Xii High accuracy flexible placement system 0201 to 54mm square or up 100mm long connectors BGA, uBGA, ICs, 0201 20MM tall parts 84 feeder inputs 2 x SF uper fine heads Front sid
Industry News | 2002-07-25 15:47:31.0
Glenbrook Technologies has announced the availability of a newly developed X-ray inspection system, MICROTECH RTX113. The MICROTECH model is designed for ultra-high resolution X-ray inspection requirements such as laser drilling of multi-layer PCBs and populated PCBs containing BGAs, uBGAs and Chip Scale Packages (CSPs).
Industry News | 2002-12-03 15:00:11.0
Practical Components adds new formulations
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2023-07-25 16:25:56.0
This paper address two significant applications of stencils in advance packaging field: 1. Ultra-Thin stencils for miniature component (0201m) assembly; 2. Deep Cavity stencils for embedded (open cavity) packaging. As the world of electronics continues to evolve with focus on smaller, lighter, faster, and feature-enhanced high- performing electronic products, so are the requirement for complex stencils to assemble such components. These stencil thicknesses start from less than 25um with apertures as small as 60um (or less). Step stencils are used when varying stencil thicknesses are required to print into cavities or on elevated surfaces or to provide relief for certain features on a board. In the early days of SMT assembly, step stencils were used to reduce the stencil thickness for 25 mil pitch leaded device apertures. Thick metal stencils that have both relief-etch pockets and reservoir step pockets are very useful for paste reservoir printing. Electroform Step-Up Stencils for ceramic BGA's and RF Shields are a good solution to achieve additional solder paste height on the pads of these components as well as providing exceptional paste transfer for smaller components like uBGAs and 0201s. As the components are getting smaller, for example 0201m, or as the available real estate for component placement on a board is getting smaller – finer is the aperture size and the pitch on the stencils. Aggressive distances from step wall to aperture are also required. Ultra-thin stencils with thicknesses in the order of 15um-40um with steps of 15um are used to obtain desired print volumes. Stencils with thickness to this order can be potential tools even to print for RDLs in the package.
ALTERA New and Original 10M16SAU169I7G in Stock UBGA-169 package ALTERA New and Original 10M16SAU169I7G in Stock UBGA-169 package ALTERA New and Original 10M16SAU169I7G in Stock UBGA-169 package MMBT3906 NXP NCX2200GW NXP NX7002AK,215 NXP NX7
Innovative, Affordable, Upgradeable Glenbrook's RTX Series of modular, real-time systems includes models designed to meet a variety of production requirements. A well-defined path allows for easy upgrading through years of use. Numerous options mak
Career Center | Middleboro, Massachusetts USA | Production
Highly motivated SMT Repair/ Assembly Operators needed for Contract Electronics Manufacturer. Duties include: repair and soldering of SMT and TH components, assembling of PCB's, and operation of automated production equipment. Experience using vario
Career Center | Boise, Idaho USA | Engineering
In need of a contract engineer ASAP!! This person will help with the fabrication of implantable medical devices. Incumbent must have electronic packaging and uBGA experience. The qualifications are below. This position will be from 3-9 months and nee
.gif)
