Industry Directory | Manufacturer
FINE PITCH ASSEMBLY. SIMPLY BETTER AT WHAT WE DO.
Industry Directory | Consultant / Service Provider / Manufacturer
Full Service Electro Mechanical and Electronic Contract Assembly Services Provider
The Sniper SMD-7007 combines the reflow operation of the Flo-master with the latest technology in optic and alignment design. It provides absolute control in positioning all ultra fine pitch QFP, CSP, BGA, uBGA, Large Ceramic or plastic BGA devices
We use only the Hi-tech placing machines for our production. Our production capacities : 40.000 comp. per hour. We are able to assemble following SMD components : 0201 Chip, BGA(45x45), uBGA, Best fine pitch QFP, SMD Connectors, etc.
Electronics Forum | Wed Feb 24 11:00:12 EST 1999 | Steve Schrader
Are the terms "uBGA" and "Fine Pitch BGA" synonomous, different all-together, or is Fine Pitch BGA a subset of uBGA? Thanks. Steve
Electronics Forum | Mon Sep 24 20:38:27 EDT 2001 | davef
Mike's comments are well taken. Your technique works fine with BGA, but uBGA are less forgiving. Again, let's take about: * Specifics of the problem. * Amount and method of applying flux. * What's holding the uBGA in-place before the solder ball an
Used SMT Equipment | Pick and Place/Feeders
ake: DDM Novastar Model: LS-40 Vintage: 2019 Description: Pick & Place Details: Max Board Size: 13.5′ x 22′ Smallest Component Capacity: 0201 Components Largest Component Size: 1.378′ Square Body Placement Accuracy: ±0.001′ (0.025mm) Max Placemen
Used SMT Equipment | Pick and Place/Feeders
Make: DDM Novastar Model: LE-40 Vintage: 2017 Description: Benchtop Pick & Place Details: Benchtop Max Board Size: 13.5′ x 22′ Smallest Component Capacity: 0201 Components Largest Component Size: 1.96′ Square Body Placement Accuracy: ±0.001′ (0.0
Industry News | 2017-05-08 16:50:24.0
Scienscope International today announced that Nimbletronics LLC selected the X-Scope 2000 X-ray Inspection System. The company operates out of a humidity-controlled manufacturing facility in Plano, TX, a suburb in the Dallas/Ft. Worth Metroplex. Nimbletronics is part of the 900 acre Research/Technology Crossroads (RT) district.
Industry News | 2004-10-15 10:33:00.0
The new FLX2010 SMD pick+place from ESSEMTEC offers the most flexible
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Demonstrates desoldering, solder paste printing, and installation of a fine pitch QFP 208 (30.6mm x 30.6mm) component using an ATCO model AT-GDP Placement & Rework Station.
http://www.ddmnovastar.com/pick-and-place - DDM Novastar manufactures a selection of benchtop and free standing surface mount placement equipment for use in automatic and manual SMT PCB assembly . This equipment is specifically designed for facilitie
Career Center | Middleboro, Massachusetts USA | Production
Highly motivated SMT Repair/ Assembly Operators needed for Contract Electronics Manufacturer. Duties include: repair and soldering of SMT and TH components, assembling of PCB's, and operation of automated production equipment. Experience using vario
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/xpf-l-fuji-xpf-l-fine-pitch-placer-217430?page=155
FUJI FUJI XPF-L Fine Pitch Placer XPF-L | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products FUJI XPF-L Fine Pitch Placer Public Pricelist Public
Lewis & Clark | http://www.lewis-clark.com/product/mydata-feeders-tm8fc-8mm-fine-pitch-magazine/
Mydata/Mycronic Feeders TM8FC -8mm Fine pitch Magazine - Part# L14021C - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal
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