Industry Directory | Consultant / Service Provider / Manufacturer
Our Ultrasonic Stencil cleaners and 440-R-SMT Detergent are US & CA EPA Certified cleaners, that are environmentally and user safe. We are your single source for cleaning any type of solder paste from any fine pitch stencil.
Industry Directory | Manufacturer
We manufacture and market stencil rolls for the PCBA industry. The cleaning material is ideal for cleaning stencils with fine pitch apertures. It prevents smearing, solder balls and other problems on the PC boards. Our stencil product is of high g
DEK Galaxy SMT Stencil Printer Maximum printing surface： 510 mm* (X) x 508.5 mm (Y)Printing speed: 2 mm/sec to 300 mm/secWeight: Approx. 680 kgProduct description: DEK Galaxy SMT Stencil Printer, Maximum printing surface： 510 mm* (X) x 508.5 mm (Y),
2.0 Cmk @ ± 25 μmProduct description: DEK E Seriels SMT Stencil Printer E by DEK, core cycle time: 8 seconds, Substrate size: 620 mm (X) x 508.5 mm (Y), System alignment capability: > 2.0 Cmk @ ± 25 μm DEK E SMT Stencil Printer DEK E SMT Stenc
Electronics Forum | Wed Jul 02 03:12:31 EDT 2003 | Joanna
We have been having problems with solder paste balls around fine pitch ICs and have decided that cleaning the boards in an ultra sonic cleaner may reomove these solder balls. However we are worried that the ultrasonic cleaning process may damage the
Electronics Forum | Thu Jun 16 09:13:46 EDT 2005 | russ
We use a 5 mil for 16mil pitch QFPs, Make sure that the stencil has been polished. Type 3 paste. We have used lead free no-clean, lead no-clean, and water soluble lead pastes for these packages. We set the printer for a slow stroke .7 in/min. wi
Used SMT Equipment | Screen Printers
This is MPM AP/S Hi E Manufactured in Year 2000 Equipped with 2D vision Under-stencil cleaner Hi E option for ultra fine pitch. Good working condition
Used SMT Equipment | Screen Printers
The MV-100 uses production-proven technology. It is fitted with sophisticated menu-driven control software for fast set-up and ease of use, making it one of the most user-friendly printers available. The tooling system is SMEMA compliant and will pro
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Industry News | 2024-10-06 19:52:39.0
The SMTA is thrilled to announce the launch of the Ultra HDI (UHDI) Learning Pavilion, a first-of-its-kind experience dedicated to advancing Ultra-High Density Interconnect technology. Taking place in booth #2753 during SMTA International, October 22-24, 2024 in Rosemont, Illinois, this interactive and educational pavilion is FREE and open to all attendees.
Technical Library | 2008-01-16 18:25:55.0
The consumer's interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes for these ultra fine pitch packages are extremely complex and each step in the assembly process influences the assembly yield and reliability.
Technical Library | 2010-03-25 06:26:37.0
The complexity of Printed Circuit Assembly process is increasing day by day and causing productivity issues in the industry, introducing ultra fine pitch components (pitch less than 15mil) in PCA is a challenge to minimize risk of defects as solder short, dry solder. This paper is focusing on minimizing these defects.
Panasonic AM100 SMT Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine
This is video shows how to print a PCB using a prototype foil only stencil. The SMT prototype stencil (www.soldertools.net) is made from a high nickel content material able to offer repeatable high precision apertures. The steps of alignment, printin
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Events Calendar | Wed May 10 00:00:00 EDT 2017 - Wed May 10 00:00:00 EDT 2017 | Itasca, Illinois USA
Kester to Host Technical Rework Seminar
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
SMTnet Express, August 10, 2017, Subscribers: 30,696, Companies: 10,656, Users: 23,635 High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
. Clouthier, AMTX "SMT Printing Process for Fine and Ultra Fine Pitch" 1996: Dr. Randy D. Schueller, 3M, Electronic Products Division "Reliability Results For A Wire Bondable Tape Ball Grid Array Package (TBGA)" 1995: Thomas S. Tarter, AMD; Martin P
| http://etasmt.com/te_news_industry/2013-03-23/3361.chtml
. Solder joint dimensions in SMT quickly become much smaller as advances are made toward ultra-fine pitch technology. The reliability of solder joints become more of a concern, as less and less solder is allowed for each joint
