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Hydrophobic Surfaces

Hydrophobic Surfaces

Videos

NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste

Fine Line Stencil, Inc.

Thermal Capabilities of Solder Masks and Other Coating Materials - How High Can We Go?

Technical Library | 2019-09-24 15:41:53.0

This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of: Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications. The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes.

Lackwerke Peters GmbH + Co KG

Panasonic SP70 Screen Printer

Panasonic SP70 Screen Printer

New Equipment | Printing

Ultra-high accuracy screen printing Panasonic's SP70 screen printer is designed for both high- and low-volume manufacturers who require ultra-high printing accuracy. PCBs up to 580 x 508mm are processed in a smaller footprint than previous SP-serie

Panasonic Factory Solutions Company of America (PFSA)

NanoSlic™ Gold Stencils

NanoSlic™ Gold Stencils

New Equipment | Printing

NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste

Fine Line Stencil, Inc.

MULTICORE Solder Pastes

MULTICORE Solder Pastes

New Equipment | Solder Materials

As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr

Henkel Electronic Materials

LPT Series (Large Panel Technology) In-Line Stencil Printers

LPT Series (Large Panel Technology) In-Line Stencil Printers

New Equipment | Printing

World's Largest Print Area Stencil Printers for Ultra Fine pitch solder paste printing Models with 24" x 24", 30" x 32", 30" x 38", 30" x 46", and 30" x 60" Print Areas Windows NT-Based Operating System Accu-Lign Series 3 Automatic Visio

Surface Mount Techniques

Split-Vision SMD Rework System Removes, Places, and Solders BGAs, CSPs, QFPs; Features Five Thermocouple Inputs, Automated Optics

Industry News | 2011-07-13 18:24:32.0

The premier model in Manncorp’s line of surface mount rework systems, the BR810 is designed for safe removal, precise placement, and reliable soldering of the most delicate and sensitive SMD packages found in the industry’s most challenging board repair applications.

Manncorp

YAMAHA Wins Coveted NPI New Product Award at APEX 2017 for Revolutionary Z:TA-R / YSM40R Modular Surface Mounter

Industry News | 2017-02-24 09:43:26.0

Yamaha Motor Corporation, USA won a coveted New Product Introduction (NPI) Award for the company’s new ultra‐high‐speed Z:TA-R / YSM40R modular surface mounter, which boasts the world’s fastest placement rates and area productivity at 200,000 CPH. The award, sponsored by UP Media/Circuits Assembly magazine, was presented on Tuesday, February 17, 2017 at the IPC/APEX 2017 Conference and Exhibition at the San Diego Convention Center and was accepted by George Babka, Sales General Manager. NPI Awards recognize the leading new products for electronics assembly introduced during the previous 12 months. Awards are selected by an independent panel of practicing industry engineers.

Yamaha Motor IM America, Inc.

MYDATA exhibits new MY200 pick-and-place machine at IPC APEX 2014.

Industry News | 2014-03-27 13:30:41.0

At APEX 2014 in Las Vegas, MYDATA will introduce to the North American market its new MY200 placement machine, delivering twice the accuracy and higher throughput.

Mycronic Technologies AB

Saki Corporation Introduces Automated X-ray Inspection for IGBT Power Modules at Productronica Stand A2.259

Industry News | 2019-11-12 12:31:32.0

Expands Saki's Lineup of Compact, Lightweight, Ultra-High-Speed Inline 3D CT Automated X-ray Inspection Systems

SAKI America


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