Electronics Forum | Mon Jan 09 07:56:49 EST 2006 | slthomas
Squeegee pressure or height, snap off, the age and/or condition of the paste and the condition/cleanliness of the stencil are about all I can come up with, unless you got a new stencil and you changed the design parameters or they made it wrong.
Electronics Forum | Tue Oct 12 22:22:34 EDT 1999 | se
| Hi, | We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: | | 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? | 2- Is anybody using
Electronics Forum | Mon Feb 04 22:29:55 EST 2013 | armandogomez
This is a very common question, I can relate to your question I have here almost the same setup on the smt line, printer a DEK, MY12 and an awful versatronics oven, about the question about the responsibilities, here the operator has only the knowled
Electronics Forum | Mon Sep 21 22:25:05 EDT 2009 | davef
What babies!!!! Sure, give it a try. * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print height equals 1/3 thickness] * For 0603, a
Electronics Forum | Fri Oct 09 06:32:38 EDT 2009 | davef
Here's what is on that post referred to, not sure what you need more than ... "* Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print
Electronics Forum | Tue Nov 03 11:46:52 EST 2009 | davef
Search the finee SMTnet Archives for previous posts on the topic. Here's a clip from on of those posts that may get you started. [snip] * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, availa
Electronics Forum | Wed Mar 23 11:40:21 EDT 2022 | SMTA-64388039
In my experience a distance of 30 mils per 1 mil in height above PCA nominal is sufficient for the squeegee blade to bend (in the direction of squeegee travel) so that you don't have excessive solder issues near the label. Labels are about 5 mils ta
Electronics Forum | Mon Apr 09 13:28:06 EDT 2001 | slthomas
I've been wondering if I was the only person thinking this. There are so many print parameters that are programmable now on new machines (squeegee pressure, height, speed, snap-off settings, cleaning intervals) that the process would (in my oh-so-hu
Electronics Forum | Tue Oct 12 11:47:51 EDT 1999 | Jose RG
Hi, We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? 2- Is anybody using step stenc
Electronics Forum | Thu Aug 12 22:31:10 EDT 1999 | Dave F
| Hello, | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | B.Regards, | Felix | Felix: There are some 30 variables that affect SMT solder qua
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