Electronics Forum | Mon Jun 28 11:51:36 EDT 1999 | Brian Wycoff
| | | | Dear guys, | | | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thicknes
Electronics Forum | Mon Sep 03 03:32:47 EDT 2001 | johnw
Franky, what method are you using for printing glue? metal stencil or plastic?, and is it on contact or off contact ? and what type of squeegee's are you using? basically give us more infomation. In term's of measuring height / volume, you can do t
Electronics Forum | Wed Jun 24 00:33:07 EDT 1998 | Phillip Hunter
| | The Ultraprint blade is fine and so is the PERMALEX BLADE. I'm so steamed right now that I actually advertised for Alpha. Now I'm even more upset! They probably even killed Kenny (those Bastards!!) | | | | | So my salesman says to me that we cou
Electronics Forum | Thu Aug 31 00:07:24 EDT 2000 | Ramon I Garcia C
I Kyung: I'm not sure if we are working with PIHR but we insert some pines in a PCB with a pin inserter machine, after that we run this pcb in a screen printer and put over its solder paste, and then run in a chip shooter and then IC placer and f
Electronics Forum | Tue Oct 12 10:24:50 EDT 1999 | Jose RG
Hi, We are in the way to evaluate different solder pastes, improve our solder paste incoming inspection steps, re-define our stencil requirements and the following questions are open. Two questions, 1- Is anybody using/requiring 1000 Kcps or more
Electronics Forum | Thu Nov 07 16:02:06 EST 2019 | kylehunter
OK, got a lot of information today doing some testing.. Version number:- 07 SP11 (985 B02) Released Dec 8 2006 I did the tool(less) calibration of the squeegee height, which worked fine, no error. Did a test print, as you can see from the image, t
Electronics Forum | Fri Dec 28 17:44:41 EST 2007 | flipit
Back in the mid 90s I used an SVS 3D solder paste inspection system. We used it as a stand along unit but it was an inline model. We would bring printed PCBs off the Dek 265 solder printers and check every 5 or 10 printed panels. They almost alway
Electronics Forum | Tue Jun 01 07:26:55 EDT 2004 | johnwnz
Alistair, your paste deposit is controlled by a few things: Stencil thickness Squeegee pressure Squeegee speed Print gap in 99 out of 100 applications for paste printing you would have a print gap of 0 i.e. on contact printing where the PCB is in fu
Electronics Forum | Sun Apr 26 08:36:55 EDT 2009 | davef
First, in direct answer to your question, DOE printer setup variables (MPM): * Squeegee speed: 0.5 to 1.0 in/sec * Pressure (metal): 1lb/in of blade * Pressure (plastic): 1.6-3 lb/in Second, supprting earlier responses, most people monitor paste hei
Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean
| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We
