UV & Thermal cure epoxies for us as glob tops, underfill and encapsulants.
Technical Library | 2014-02-27 15:30:20.0
Silicon dioxide is normally used as filler in underfill. The thermal conductivity of underfill is less than 1 w/mk, which is not able to meet the current flip chip application requirements such as 3D stacked multi-chips packaging. No matter which direction the heat will be dissipated through PCB or chip, the heat has to pass through the underfill in 3D stacked chips. Therefore the increase of thermal conductivity of underfill can significantly enhance the reliability of electronic devices, particularly in 3D package devices
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Industry Directory | Manufacturer
Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.
Industry Directory | Manufacturer
Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.
PPM 5000 Dispensing System for Large PCB up to 36" x 60". Wide range of pumps available to dispense Solder Paste, Epoxy, Underfill. Inspection available for some applications. Custom built to your requirements.
PPM 5000 Dispensing System for Large PCB up to 36" x 60". Wide range of pumps available to dispense Solder Paste, Epoxy, Underfill. Inspection available for some applications. Custom built to your requirements.
Industry Directory | Manufacturer
Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly.
SMT 158UL is a super-fast flow capillary underfill, which can flow into 10μm gap at room temperature without preheating a substrate. After cure there is void free in underfill. The cured SMT 158UL can be easily reworked. SMT 158UL not only can be use
SMT 88UL is a super-fast flow capillary underfill, which can flow into 10μ gap at room temperature without preheating a substrate. After cure, there is void free in underfill. The cured SMT 88UL can be easily reworked. SMT 88UL not only can be used a
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