Full Site - : underfill remove bga ic (Page 4 of 12)

FINEPLACER� Application Packages for Advanced Rework � PoP/Underfill/01005/Single Ball

Industry News | 2007-11-27 12:01:32.0

FINETECH application packages offered for FINEPLACER� rework systems provide an easy way to enhance the machine�s scope of application. These packages include custom-tailored modules and tools to ensure perfect results for special rework applications.

Finetech

Solder Joint Encapsulant

Industry News | 2015-05-13 14:00:03.0

The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.

YINCAE Advanced Materials, LLC.

Zhuomao ZM-R6821

Zhuomao ZM-R6821

Videos

1.The top heater can move freely along the X, Y axis in the IR preheating area It is good for many BGA chips distribution at different positions in the PCB board which need repair X-shaped infrared laser can do rapid location After location the elect

Shenzhen Zhuomao Technology Co., Ltd

Indium Corporation Experts to Present at IMAPS

Industry News | 2020-09-10 11:16:53.0

Two Indium Corporation experts will present technical content during IMAPS International Symposium on Microelectronics, a global virtual event, Oct. 5-8.

Indium Corporation

SHENMAO to Showcase Advanced Automotive Electronic Solutions at 2024 IPC APEX EXPO

Industry News | 2024-03-18 12:35:19.0

SHENMAO Technology will exhibit its cutting-edge solutions for automotive electronics at Booth 2639 during the upcoming IPC APEX EXPO 2024. Taking place April 9-11, 2024 at the Anaheim Convention Center in California, the expo will provide an opportunity for industry professionals to explore SHENMAO's latest advancements in solder paste technology.

Shenmao Technology Inc.

Heraeus Electronics provides latest materials portfolio for next-generation power electronics and semiconductor advanced packaging at NEPCON Japan 2023

Industry News | 2023-01-23 18:38:38.0

Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place January 25-27, 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.

Heraeus

Machine Vision Products to demonstrate complete AOI solutions at APEX 2011

Industry News | 2011-04-05 21:42:34.0

Machine Vision Products (MVP) will be demonstrating its expanded range of AOI systems at APEX 2011 in Las Vegas. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Booth 1647.

Machine Vision Products, Inc

SHENMAO to Debut New Pastes & Fluxes at electronica China

Industry News | 2019-03-05 17:59:34.0

SHENMAO America, Inc. is pleased to announce that it will exhibit at electronica China, scheduled to take place March 20-22, 2019 at the Shanghai New International Expo Centre. The company will showcase its PQ10 series low temperature solder paste, new P250 series solder paste for automobile electronics, PW215 water soluble solder paste, SMF-WC53 water soluble ball-attach flux and solder sphere, and water-based wave soldering flux & water-based cleaner.

Shenmao Technology Inc.

Seika Machinery to Exhibit at SMTA Dallas 2009

Industry News | 2009-03-02 00:10:24.0

TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.

Seika Machinery, Inc.

Machine Vision Products to announce expanded range of SMT AOI solutions and Microelectronics AOI applications at APEX 2010, Las Vegas

Industry News | 2010-04-01 15:45:58.0

Carlsbad, CA – April 2nd, 2010: Machine Vision Products (MVP), a leader in Automated Optical Inspection will be announcing an expanded range of AOI systems at APEX 2010 in Las Vegas. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 16 years of service to the industry. MVP will be exhibiting at Booth 1647.

Machine Vision Products, Inc


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