Electronics Forum | Fri Mar 28 16:27:43 EDT 2014 | hegemon
Lol Dave. Give me a lever long enough....
Electronics Forum | Mon Sep 28 09:23:03 EDT 2015 | slave2anubis
Hi, sorry for reopening a old thread, but i wanted to ask if there is a way to know at what temperature the solder melts if you have a chip with underfill? I thnk its lower then normal air-fill temperature since the underfill conducts heat better the
Electronics Forum | Tue May 16 15:53:09 EDT 2006 | Manvendra Verma
What is the solution for removing epoxy on BGA ics?
Electronics Forum | Wed Apr 27 13:17:10 EDT 2005 | Rush Fan
Is there anyone using an SRT Summit 1100 to perform BGA removal/rework with underfill? I am interested in knowing how their site-scavenging equipment works and would like to here anyones' overall comments. Anyone know if I could see this process in a
Electronics Forum | Fri Jul 13 00:11:41 EDT 2001 | qinongzhu
We are preparing a batch of samples for test. several IC which packaged by BGA/CSP was removed from PCB by reworkstation. However, I need to re-use this IC. I want to know whether there is a way to remove the solder balls from these IC devices and ca
Electronics Forum | Wed Mar 25 03:27:13 EDT 2015 | slave2anubis
Hi davef, thank you for sharing this. Yes all manufacturers recommend their products, and i dont deny that they are good but for a small shop like i have i think the prices are a bit high. What i think would be a good technique, is heating the area t
Electronics Forum | Sun Jun 05 13:42:16 EDT 2005 | amigo
We find it impossible to remove the glued micro-BGA chips like the CPU and the UEM ICs used in Mobile Phones. They are both surface mount devices and glued with some chemicals we think. Any help is most needed in this matter.
Electronics Forum | Thu Mar 31 11:12:39 EDT 2022 | proceng1
I feel like any chemical that will remove the solder will be much more detrimental to everything else. I have also never had to re-program an IC after reflow.
Electronics Forum | Thu May 30 07:28:15 EDT 2002 | jaltland
Ben, Thanks for the input on the apertures and thickness. The side two problem, is not reflow. We have no trouble with reflow. The problem is that our product is high precision crystal oscillators. In order to get the precision needed, we have t
Electronics Forum | Wed Dec 24 11:49:46 EST 2008 | bandjwet
Put on your thinking caps for this one......We are trying to remove a BGA (10 x 10mm, plastic, 0.8mm pitch) which is approx 3 mm next to another BGA (5 x 5mm, plastic, 0.8mm pitch). The challenge is this second device is underfilled with a softening
