Industry News | 2022-03-29 07:16:39.0
Viscom AG continues its success story in the field of manual and automated X-ray inspection (3D-MXI) with a new high-quality system: like its predecessor X8011-II PCB, the X8011-III offers outstanding flexibility in inspection tasks and extremely high resolutions – plus brilliant and highly detailed image quality.
Industry News | 2007-10-30 00:56:03.0
Aesch/Switzerland � Essemtec AG, Switzerland, a leading manufacturer of surface mount technology production equipment, announces that it will highlight CSM7100V, a highly flexible pick-and-place system with intelligent feeders and vision for high-mix/low-volume production, in booths A5-277 and A5-278 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2008-03-14 19:45:10.0
Glassboro, NJ � Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will introduce RO-VARIO, a reflow oven with a new, flexible concept, in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
Industry News | 2011-04-07 11:39:03.0
Viscom AG, and CyberOptics, jointly announce an OEM agreement to equip Viscom's SPI inspection systems product line with CyberOptics' 3-D SPI sensor technology.
Industry News | 2012-10-03 14:48:48.0
ACD, was named to the 2012 Fast Tech listing, appearing in the #23 spot. Fast Tech honors the fastest growing technology companies in North Texas based on three-year revenue growth and is part of the Metroplex Technology Business Council’s Tech Titans Awards Gala.
Industry News | 2015-01-20 16:51:31.0
Viscom announced today that it will exhibit in Booth #1017 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Viscom’s inspection experts will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market.
Industry News | 2018-11-14 15:34:52.0
Viscom AG will premier a new 3D bond inspection system at electronica 2018 in Munich. The Hanover-based inspection technology expert is thus expanding its diverse 3D product range from 3D SPI, 3D AOI and 3D X-ray technology to include bond inspection, further reinforcing its technology leadership in 3D inline inspection for the electronics manufacturing industry.
Industry News | 2015-11-16 10:47:48.0
Catching up with PNC with Dan Beaulieu, D.B. Management Group
Industry News | 2021-11-22 06:40:32.0
Three Indium Corporation experts will present on the evolution of high-temperature lead-free solders, thermal management challenges for advanced packaging, and give a sponsored presentation on the company's high-performance, high-reliability materials during the virtual Electronics Packaging Technology Conference (EPTC), Dec. 1-3.
Industry News | 2003-04-01 08:48:49.0
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