Industry News | 2023-08-21 12:08:58.0
The critical reliability of electronic prosthetics in the brain to help restore movement to a paralyzed hand, enhancing the durability of EV automotive infrastructure, testing criteria and challenges of working with lead-free materials, and evaluation of reliability and maintainability for safe airborne structures are just a few of the agenda items offered at IPC's High Reliability Forum October 17-19 in Linthicum (Baltimore), Md.
Industry News | 2013-04-17 11:13:48.0
IPC ESTC will feature eight professional development courses examining packaging, materials, design and assembly considerations in electronics, from bare board to end-product, May 20–21 and May 23, 2013, at The New Tropicana in Las Vegas.
Industry News | 2010-07-20 13:46:58.0
Collaborating to offer an unmatched regional event for companies and their employees, IPC — Association Connecting Electronics Industries® and Canon Communications are bringing the best of the global electronics manufacturing industry together at Electronics Midwest, September 28–30, 2010. Taking place at the Donald E. Stephens Convention Center in Rosemont, this premier event will feature an exhibition as well as an IPC technical conference on electronics sustainability, workshops on new standards and assembly materials, and IPC standards development meetings.
Industry News | 2011-11-30 13:07:59.0
Genuine electronics manufacturing industry concerns, challenges and problems will be addressed in 50 IPC APEX EXPO professional development courses, February 26–27 and March 1, 2012, at the San Diego Convention Center.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2003-04-23 08:39:30.0
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If you require quality automation with warranties up to 5 years, or wish to sell machines give us a call (517) 521-2020 or email at 4TechUSA.com We are here to help ! Universal Instruments Model GSMX Precision placement system with the High force
Technical Library | 2015-02-27 16:46:30.0
During the last period of newly assembled electrical devices (pcbs), new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements based on the automotive and industrial industry. In the narrow gaps under components, residues can accumulate more by the capillary forces. This is not that much a surface resistance than an interface issue. Also that the flux residues under such types of components creates interaction with the solder resists from the pcb, as well as the component body was not completely described in the standard SIR measurement. On the other hand also, electrical influence with higher voltage creates new terms and conditions, in particular the combination of power and logic in such devices. The standard SIR measurement cannot analyze those combinations.The paper will discuss the requirements for a measurement process, and will give results. The influences of the pcb and component quality will also be discussed. Furthermore it will describe requirements for nc solder paste to increase the chemical/thermical/electrical reliability for whole devices
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The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
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