Used SMT Equipment: universal instruments cut/form, exterior -n clinch (20)

Universal Instruments 6360B

Used SMT Equipment | THT Equipment

Need Universal Radial 8 triple span machine. Prefer 6380B model, but can consider on maybe other triple span model also. 20 station is enough. prefer if sequncer is parallel with the insertion unit behind that. N clinch need and board handling opt

Salescon Ltd.

Universal Instruments 6346A

Used SMT Equipment | THT Equipment

Manufacturer: Universal Instruments Model Number: 6346A Serial Number: 56522-6-3092 Input Power: 115V Features: 20 Station, N Style Clinch Asset Number: 5406

EAS Inc.

Parts & Supplies: universal instruments cut/form, exterior -n clinch (47)

Universal Instruments 43837601 43837603 GSM2 X Axis

Universal Instruments 43837601 43837603 GSM2 X Axis

Parts & Supplies | Other Equipment

Universal 43837601 43837603 GSM2 X Axis Encoder 43682901 PC CD,CARD EXTENDER 43689807 TUBING CABLE CARRIER 43695501 BEARING,FL NYLON 43696801 BLADE,CAM 43696901 JAW,RIGHT 43697001 JAW,LEFT 43697701 PUSHER ASSY 43704801 ARM 43705201 CYLINDER,

Jinchen Electric Technology Co,.Ltd

Universal Instruments 46806401 FORMER OUT

Universal Instruments 46806401 FORMER OUT

Parts & Supplies | AOI / Automated Optical Inspection

UNIVERSAL 46806401 FORMER OUT 46806401 FORMER OUT The following is a list of some of our products: if you can't find the part number, you can contact becky@hysmt.cn No. Part Number Description 111 41499603 ANVIL, VSL 112 41820201 CL

ZK Electronic Technology Co., Limited

Express Newsletter: universal instruments cut/form, exterior -n clinch (650)

Partner Websites: universal instruments cut/form, exterior -n clinch (56)

Cut and Clinch Archives - Lewis and Clark, Inc.

Lewis & Clark | https://www.lewis-clark.com/product-tag/cut-and-clinch/

Cut and Clinch Archives - Lewis and Clark, Inc. Skip to content My Cart:  $ 0.00 0 View Cart Checkout No products in the cart

Lewis & Clark

Best Papers - Award Winners | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm

., Sandia National Laboratories "Sensitivity of Copper Dissolution to the Flow Behavior of Molten Sn-Pb Solder" 2013: Babak Arfaei, Ph.D., Universal Instruments Corporation "Effect of Sn Grain Morphology on Failure Mechanisms and the Reliability of Lead-Free Solder Joints in Thermal Cycling Tests" 2012

Surface Mount Technology Association (SMTA)


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