Technical Library | 2007-06-27 15:43:06.0
Traditionally most flip chips were designed with large bumps on a coarse pitch. However, as the trend towards smaller, more compact assemblies continues the sizes of semiconductor packages are forced to stay in line. New designs are incorporating smaller bump diameters on increasingly aggressive pitches, and in many cases decreasing the total IO count. With fewer and smaller bumps to distribute the load of the placement force it is becoming increasingly vital for equipment manufacturers to meet the challenge in offering low force placement solutions. One such solution will be presented in the following discussion. Also presented will be ways to minimize the initial impact spike that flip chips experience upon placement.
Used SMT Equipment | In-Circuit Testers
Teradyne Z1888 ICT Test System Auction # 40 From Multiple Locations: www.xlineassets.com Key Equipment: • Universal HSP 4797L Chipshooter, SN 10085098, Includes (40) Assorted Feeders (15) HD0804, (15) HE0804, (3) HE1204, (3) HE1208, (2) H
Parts & Supplies | Other Equipment
45711401 BELT,TIMING 45711601 ANVIL,CONTINUITY 45711604 ANVIL, CONTINUITY 45711901 PC CD,MULTI INPUT 2 ASM 45712401 MANIFOLD ASSY 45712702 TAPE FEEDER 56X8 45712703 TAPE FEEDER 56X12 45712704 TAPE FEEDER 56X16 45712705 TAPE FEEDER 56X
Used SMT Equipment | Pick and Place/Feeders
Universal Multi Function Placement Machine Model: AX-72E Product Code: 4984B Vintage: 2007 SW: UPS+ 6.6.0.0 GMC OS: Windows 2000 Flex Mounter Single Beam - 2 Heads (IL7 & IL4) Fully Functional Variety of Feeders Available
Technical Library | 2007-03-28 10:18:33.0
Legislation against the use of lead in electronics has been the driving force behind the use of lead-free solders, surface finishes, and component lead finishes. The major concern in using lead-free solders in the assembly and rework Chip Scale Packages (CSPs) is the relatively high temperatures that the components and the boards experience. Fine-pitch CSPs have very low standoff heights following assembly making inspection and rework of these components more difficult. One other concern pertinent to rework is the temperature of the neighboring components during rework. These issues, coupled with the limitations of rework equipment to handle lead-free reflow temperatures, make the task of reworking lead-free assemblies more challenging.
Used SMT Equipment | Pick and Place/Feeders
Universal Multi Function High flexibility Placement systems. Some features include: * 7 Spindle FlexJet Head * 4 Spindle Flexhead * Windows Upgraded UPS+ highest rev * DPTF automated matrix tray feeder * FlexJet nozzle Changers * FlexHead nozz
Used SMT Equipment | Pick and Place/Feeders
Rare opportunity for high productivity & flexibility at considerable cost savings. Universal Multi function GSM2 With: * 7 spindle FlexJet chip shooter head-beam 2 * 4 Spindle C4 Precision FlexHead-beam 1 * large board 25" option * Windows UPS
Parts & Supplies | Repair/Rework
======= REPAIR COST USD35.00 / UNIT ========== We are expert in repairing of Multi Pitch Feeder Controller Board for Universal GSM SMT machine, Hover Davis 048C-002 REPAIR COST IS ONLY USD20.00 / PCS, INCLUDING REPLACEMENT PARTS !! Want to rep
Used SMT Equipment | Other Equipment
Manufacturer: Universal Instruments Model Number: 6772A Description: Multi-Mod Dip Inserter Serial Number: 30281001-8C13-CDP1577 Input Power: 120V, 60Hz, 90 PSI,12 Amp,12 SCFM,Single Phase Features: .300/.600 Tooling, 24 PIN/42 PIN, Stand Alone,
Used SMT Equipment | THT Equipment
Manufacturer: Universal Instruments Model Number: 6772A Serial Number: 16134043337301 Description: Multi-Mod Dip Inserter Input Power: Input Power: 120V, 15A, 60Hz, 90Psi, Single Phase Features: 18" x 18" Rotary Table, J-11 Controller, Board Err
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