Industry Directory | Equipment Dealer / Broker / Auctions
WINTECH provides new/used/pre-owned SMT, AI & PCB Assembly (PCBA) equipment of various brands. Also supply service, modification & original or local-made spare parts. We are also an appointed agent for well-known brands.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
Hanwha DECAN F2 Pick and Place Machine High Speed:120,000 CPH Ultra Slim Design with a Total Length of 1.25m Applies High Rotary Modular Head Side-view Vision System Product description: Hanwha DECAN F2 Pick and Place Machine High Speed SMT Modular
JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603～50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603～50mm, Place Speed:15,500 CPH
Electronics Forum | Mon Sep 30 16:36:00 EDT 2013 | richardconnell
I have a Universal Instruments Corporation TAB Bonder. Oldish machine. Initial fault on machine : - "Axis Head 1 Z DAC Limit error during move absolute command" Other fault seen after we reset power, Zeroed axis etc. - Axis Head 1 - Z error not re
Electronics Forum | Tue Oct 01 18:44:24 EDT 2013 | richardconnell
Hi, I have limited capability on the Z axis. The axis will home to the mechanical switch limit and then drop to a point which I asssume to be the fiorst zero point below the mechanical switch limit. Then it gives the error. There is power to the mo
Used SMT Equipment | Pick and Place/Feeders
High speed universal mounter KE-2070 JUKI 2050 2060 2070 2080 3010 3020 FX-3 series JUKI RS-1 RS-1R JX300LED JX350 JM10 JM20 JM100 Panasonic CM402 602 NPMD3 DT401 CM401 YAMAHA YG12 YG200 YS12 YS24 YSM10 YSM20 YSM40 YG100A 100B Samsung SM421 47
Used SMT Equipment | Pick and Place/Feeders
High speed universal mounter KE-2080 Other machines we are interested in: JUKI 2050 2060 2070 2080 3010 3020 FX-3 series JUKI RS-1 RS-1R JX300LED JX350 JM10 JM20 JM100 Panasonic CM402 602 NPMD3 DT401 CM401 YAMAHA YG12 YG200 YS12 YS24 YSM10 YS
Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Industry News | 2003-06-20 08:54:22.0
Service Pack 1 for P-CAD 2002 released today
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Parts & Supplies | AOI / Automated Optical Inspection
AI accessories universal cutter 44241607 43871802 Universal plug-in machine AI part 44241409 Universal plug-in machine AI part inner forming knife (left) with tungsten steel 44241509 Universal plug-in machine AI part inner forming knife (right)
Parts & Supplies | AOI / Automated Optical Inspection
Light source assy 27380000 for universal ZK Electronic Technology Co.,Limited becky@hysmt.cn skype:beckysmt wechat:15323874439
Technical Library | 2017-03-02 18:13:05.0
The need for more energy-efficient solid-state switches beyond complementary metal-oxide-semiconductor (CMOS) transistors has become a major concern as the power consumption of electronic integrated circuits (ICs) steadily increases with technology scaling. Nano-Electro-Mechanical (NEM) relays control current flow by nanometer-scale motion to make or break physical contact between electrodes, and offer advantages over transistors for low-power digital logic applications: virtually zero leakage current for negligible static power consumption; the ability to operate with very small voltage signals for low dynamic power consumption; and robustness against harsh environments such as extreme temperatures. Therefore, NEM logic switches (relays) have been investigated by several research groups during the past decade. Circuit simulations calibrated to experimental data indicate that scaled relay technology can overcome the energy-efficiency limit of CMOS technology. This paper reviews recent progress toward this goal, providing an overview of the different relay designs and experimental results achieved by various research groups, as well as of relay-based IC design principles. Remaining challenges for realizing the promise of nano-mechanical computing, and ongoing efforts to address these, are discussed.
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
The first technology to use centrifugal energy to clean electronic circuit assemblies, precision parts, and semiconductor packages. The system offers unparalleled penetration, solubilization, and contaminant removal The MicroCel Centrifugal Cleanin
To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Tue Dec 11 00:00:00 EST 2018 - Tue Dec 11 00:00:00 EST 2018 | ,
Inspecting PWB Assemblies for Defects
Events Calendar | Tue Mar 30 00:00:00 EDT 2021 - Tue Mar 30 00:00:00 EDT 2021 | ,
Wisconsin Chapter Webinar: PCB Assembly – Labeling and Marking Technology and Materials
Career Center | Lichfield, Staffordshire United Kingdom | Engineering,Maintenance,Technical Support
UNITED KINGDOM - Staffordshire. Tel - (01543) 444 777 Fax - (01543) 444 511 www.ademco-microtech.co.uk Manufacturing Engineer/Technician required. Experience of Surface Mount and Thru-hole processes essential. Knowledge of the following equipment w
Career Center | Tucson, Arizona USA | Production
SUMMARY OF RESPONSIBILITIES � Operates all Surface Mount machines on the board assembly line. ESSENTIAL FUNCTIONS � Perform required preventative maintenance on surface mount equipment. � Data collection for SPC functions. � Assist in setup of feede
Career Center | BANGALORE, Karnataka India | Quality Control
New Model Evaluation • Testing & Evaluation of New TV models as per the relavant standards & release the defect free product for Mass Production • Measurement of audio parameters like Max out put, distotion, S/N ratio, hum, buzz etc • To conduct aud
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
SMTnet Express, May 11, 2017, Subscribers: 30,455, Companies: 10,596, Users: 23,229 Privacy Threats through Ultrasonic Side Channels on Mobile Devices Daniel Arp, Erwin Quiring, Christian Wressnegger and Konrad Rieck; Technical University
| https://www.feedersupplier.com/sale-14346570-universal-ai-button-zero-m-f-21307102-automatic-insertion-machine-spare-parts.html
Universal Ai Button Zero M F 21307102 Automatic Insertion Machine Spare Parts Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
ASCEN Technology | https://www.ascen.ltd/Products/insertion_feeder/921.html
. Universal inserter insertion feeder Features: Excellent price-performance ratio Zero stick exchange time Can custom according requirement 400mm storage capacity Additional tooling space Intelligent communication with placement system Handles all
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