Electronics Forum | Mon Oct 23 03:52:32 EDT 2017 | wendymm
Hello guys, I'm a new learner in PCB field. And recently, I have summarized some basic information I learnt on how to arrange the line on crystal oscillator, but I'm not sure if it is right. So I'll write it down below, hope anyone who may read my po
Electronics Forum | Mon Apr 05 16:12:16 EDT 2010 | dyoungquist
We are installing via reflow soldering a crystal that has 2 pads, 1 each end. They are flat pads on the bottom of the part with a small area of the pad looping around and up the side of the crystal on the end. Inspection of the cyrstal under a 40X
Industry News | 2012-06-01 13:55:57.0
As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges
Industry News | 2018-04-18 18:06:14.0
SMTA Europe announces Session 6 Technical Program on Automotive Electronics at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Technical Library | 2013-02-28 17:14:36.0
While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two different crystal forms over the temperature range to which electronics circuitry is exposed during assembly and service, it has only recently been recognized that the change from one form to the other has implications for solder joint reliability. (..) In this paper the authors report a study of the effect of cooling rates on Cu6Sn5 crystals. Cooling rates from 200°C ranged from 10°C/minute to 100°C/minute and the effect of isothermal ageing at intermediate temperatures was also studied. The extent of the phase transformation after each regime was determined using synchrotron X-ray diffraction. The findings have important implications for the manufacture of solder joints and their in-service performance... First published in the 2012 IPC APEX EXPO technical conference proceedings....
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5246
: In studying the effect of Ni on the behavior of the Sn-0.7wt%Cu solder it was found early on that nearly all the Ni ends up in the Sn-Cu intermetallic, substituting for Cu in the crystal structure so that phase can be characterized as (Cu,Ni)6Sn5
GPD Global | https://www.gpd-global.com/co_website/pdf/pump/Phosphors-LED.pdf
. This allows phosphor makers to engineer the crystal field surrounding the doping sites of the ions. This crystal field determines the covalency of the lattice, and has different effects on the energy levels of 5d and 4f electrons
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