Used SMT Equipment | Pick and Place/Feeders
JUKI KE760L / Zevatech FM760 : Completely working machine in good conditions, with some spare parts, nozzles renewed, spare mainboard/computer with LCD, manuals, etc. Supplied with 2troleys with about 70 various feeders, rack for spare feeders availa
Used SMT Equipment | Pick and Place/Feeders
The Price is negotiable. The machine has a very good looking, as new Optimal placement rate: 6,800 cph / Tact time: 0.55 sec/chip with line camera - 0.9 sec/QFP with line camera - 2.3 sec/QFP with area CCD camera. Applicable components: 0201
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Used SMT Equipment | General Purpose Equipment
Samsung Auto Pick and Place Machine 7500 pph,Lead Screw Refurbished w/ 15 8mm Feeders 2 Heads, InLine A fast (7,500 cph) machine with a long history of reliability that’s ideal for assemblers on a small budget who require high throughput. Fast and
Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte
Industry Directory | Consultant / Service Provider
PCB assembly services, both US and offshore. We handle basic through-hole to standard surface mount to ultra-fine pitch. Quote and order PCB fabrication and assembly online.
Hybrid Rework System - automatic desoldering, placement and soldering of SMT components. New definition of assembly unit repair - automatic, flexible and process reliable! Find our products ? http://www.kurtzersa.com/electronics-production-equipment
New Equipment | Assembly Services
Premium Automatic PCB Support for SMT Processes Ovation’s award-winning Grid-Lok Gold™ automatic substrate support technology provides electronics manufacturers with a robust alternative to costly and often problematic dedicated fixture plates. Set
Industry News | 2012-09-20 14:20:40.0
More and more often electronics manufacturers have to deal with large, heavy or very thin boards which frequently require support pins for the placement process in order to prevent warping or vibrations. With its SIPLACE Smart Pin Support, ASM Assembly Systems provides a hardware-software combination that simplifies this previously cumbersome and complex support pin placement process for all boards.
Flip Chip Thermosonic Bonding with the FINEPLACER® pico MA. http://eu.finetech.de/micro-assembly/products/fineplacerr-pico-ma.html More information about Thermosonic bonding: http://eu.finetech.de/micro-assembly/technologies/ultrasonic-thermosonic-b
Industry News | 2008-12-15 15:11:20.0
HUDSON, NH � December 2008 � CeTaQ, the leader in quality analysis and optimization of SMT production processes, is seeing an increased focus on placement force measurement, as quality assurance departments seek efficient methods to maintain quality, while increasing productivity to counteract decreasing profit margins.
CeTaQ Americas, LLC (formerly EAGLE-EYED ONE Sales & Service)
