Industry News | 2011-06-22 00:31:49.0
JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of a significant revision of its standard for Inspection Criteria for Microelectronic Packages and Covers, JESD9B.
Industry News | 2023-12-25 14:49:33.0
Viscom AG will be exhibiting at NORTEC in Hamburg, Germany, from January 23 to 26, 2024. The trade fair for production brings together many different industries in northern Germany, Scandinavia, and the Benelux countries – ranging from metalworking, robotics and automation to IT solutions and logistics.
Industry News | 2010-04-22 20:57:37.0
San Diego - KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it was awarded the Innovation Award for Best Supplier of the Year 2010. The award was presented to the company during an April 21, 2010 ceremony that took place at the Shanghai Everbright Convention & Exhibition Center during NEPCON China 2010.
Industry News | 2011-04-29 21:23:02.0
Data I/O Corporation announces the release of SuperBoost for FlashCORE III technology. SuperBoost significantly decreases programming times for e.MMC and SD devices and increases production throughput.
Industry News | 2017-08-03 06:30:29.0
Comet has been recognized with a 2017 Supplier of the Year Award in Innovation and Collaboration by Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. The awards were presented at Applied’s annual Executive Supplier Forum, an event highlighting the company’s commitment to build close relationships with suppliers, communicate Applied’s strategic direction and priorities, and foster supplier engagement.
Industry News | 2016-04-07 16:17:04.0
ASM Assembly Systems can look back on a very successful APEX 2016 trade show. The two lines being shown, one a high-speed line with the latest DEK NeoHorizon and SIPLACE TX modules and the other a high-mix line with super-flexible SIPLACE SX, attracted lots of visitors. The industry professionals were especially impressed that ASM already has concrete products for its Smart #1 SMT Factory concept in its portfolio, making it the leading technology partner for the future of electronics manufacturing. One of these products was the SIPLACE BulkFeeder, an innovative feeder module for high-volume production that trade publication Circuit Assembly immediately honored with its highly respective NPI Award. The SIPLACE BulkFeeder holds up to 1.5 million loose components and feeds them with exceptional precision – without tapes or splicing and the associated risks. The concept of the ASM ProcessExpert is equally revolutionary. With its integrated 5D SPM (solder paste management) system, the world's first inline expert systems controls and optimizes printing processes fully automatically. Another innovation was shown at the booth of ASM distributor Technica: With the E by SIPLACE, ASM addresses customers and applications in the mid-speed, small-lot and prototype manufacturing segments.
Industry News | 2015-12-20 15:16:07.0
Believing that the growth strategy of ASM Assembly Systems has been confirmed, CEO Günter Lauber is optimistic for 2016 despite some risks with regard to the economy. Thanks to strong demand for SIPLACE and DEK solutions, the company became the world’s largest maker of SMT equipment for the first time in 2015. The Smart #1 SMT Factory concept is expected to provide additional impulses for continued growth. At the Productronica show, the industry’s leading trade fair held in November, ASM introduced a series of new platforms, systems and solutions for advanced programming, process integration and material logistics. They enable the customers to move their production one step at a time towards SMT-specific Industry 4.0 concepts that enable them to manufacture with even more flexibility and efficiency. Lauber also believes that his company is perfectly positioned for future technologies in the wafer-based integration of components to form complex modules (such as fan-out WLCSP and system-in-package).
Industry News | 2012-12-17 19:27:01.0
Data I/O Corporation (NASDAQ: DAIO),has developed innovative solutions to enable the design and manufacture of electronics products including mobile devices, infotainment systems, navigation equipment, industrial controls, engine control units and more.
Industry News | 2022-04-28 15:05:22.0
In times of climate change and increases in energy use, the demands of power modules for the efficient and reliable control of electric motors continue to rise. Modern module concepts are reaching their limits in terms of power density, current carrying capacity, and reliability to increase lifetime and reduce costs. A critical area for improving power modules is the material system used in them, as well as their electrical and thermal interconnection.
Technical Library | 2023-11-20 17:42:33.0
Zero-defect strategies and increased demands on the production of assemblies are making quality assurance in electronics production increasingly important. Continous miniaturization of components, ever higher packing densities and the associated hard-to-view assembly areas, as well as the increased use of components such as BGAs, QFNs and QFPs, pose a considerable challenge when it comes to high-precision quality control.
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