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AT&S Announces Continuation of Share Repurchase Program

Industry News | 2003-02-24 09:40:18.0

Will continue the share repurchase program from February 25, 2003 to January 5, 2004.

SMTnet

Nippon Mining Holdings to Increase Production Capacity for Rolled Copper Foil

Industry News | 2003-03-12 09:03:48.0

Demand for the material, used in PCBs, is increasing because of folding mobile phones and other devices

SMTnet

GPS Receiver Shrinks to Surface Mounting

Industry News | 2003-03-18 10:12:41.0

The Falcom JP7 is a single-board GPS receiver with 12 parallel channels.

SMTnet

No Solder Required for Press-fit D-subs

Industry News | 2003-04-08 10:28:06.0

A new range of high-performance press-fit D-subminiature terminations from GTK can be fitted easily to PCBs without the need for solder.

SMTnet

Ease of Application for Infiniband I/O Connectors

Industry News | 2003-04-22 09:33:13.0

Honda Connectors has released its first Infiniband I/O connectors, designed for easy assembly in high-speed differential signal applications.

SMTnet

Light Pipes Reduce ESD Risks

Industry News | 2003-05-01 09:12:52.0

Press-fit panel-mount light pipes can protect circuits from accidental ESD by isolating the PCB from human contact.

SMTnet

PBC Socket Block Aids Multiboard Distribution

Industry News | 2003-05-16 08:23:59.0

A novel PCB socket block features integrated crossconnections, which facilitate daisychaining of supply voltage and signal lines in multiboard applications, saving installation time and money.

SMTnet

Package Provides Integrated Hall-effect Solution

Industry News | 2003-05-30 08:09:11.0

A new compact package integrates a Hall-effect sensor IC with a back-biasing magnet to achieve high airgap performance and meet restrictive space requirement.

SMTnet

Flatpack Relay Handles Heavy Currents Onboard

Industry News | 2003-06-20 08:18:46.0

Providing the ideal solution to high-current PCB applications where height restrictions are a major consideration is Finder's 40.11 series flatpack PCB relay.

SMTnet

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2017

Industry News | 2017-01-11 18:22:38.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #3101 at the 2017 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 14-16, 2017 at the San Diego Convention Center.

MIRTEC Corp


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