Industry News | 2017-08-03 06:15:05.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. Test and inspection solutions from Nordson DAGE, Nordson MATRIX and Nordson YESTECH will be demonstrated at the event.
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
Industry News | 2009-09-17 17:02:12.0
EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
Industry News | 2013-02-08 23:26:44.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4, that is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.
Industry News | 2014-09-06 19:37:20.0
New AXI system from the market leaders in X-ray Inspection.
Industry News | 2016-09-21 15:44:21.0
From booth #936 at the upcoming SMTA International event in Rosemont, Illinois, Henkel Adhesive Electronics’ display will underscore why the company leads the market in comprehensive assembly materials technologies. With multi-award-winning LOCTITE GC solder materials, a broad range of leading-edge thermal management technologies, and new applications for TECHNOMELT products, the Henkel booth is the go-to destination for advanced electronics assembly materials.
Industry News | 2016-06-19 19:58:06.0
Nordson DAGE, a division of Nordson Corporation will exhibit in Booth #5844 at SEMICON West, scheduled to take place July 12-14, 2016 at the Moscone Center in San Francisco, CA. The leader in X-ray inspection for electronics, Nordson DAGE will show its 4th generation, ultra-high resolution, off-line MXI X-ray system – the Quadra™ 7 – for the first time in the Americas’.
New Equipment | Industrial Automation
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New Equipment | Industrial Automation
CONTACT: NANCY LIN EMAIL:INFO@AMIKON.CN SKYPE:ONLYWNN_1 TELEGRAM:+8618020776786 MOBILE(WHATSAPP): (+86)-18020776786 QQ :2851195456 AMIKON has supplied nearly 70 million inventory parts for customers worldwide. Whether it is a new spare parts,
