The anti-wobble tool is designed for enhanced functionality when handling INTEL LGA CPU products. This tool improves placment accuracy when picking processor chips from a shipping tray and placing into precision sockets. This BULB-VAC features an ant
New Equipment | Board Handling - Storage
Eureka TD-1001 Fast Super Dryer Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/td-1001 Capacity: 657 Liters Humidity Range: LESS THAN 20% Recovery Time: Recovers to ≤ 20% RH within 30 minutes after accessing door for 30 s
Electronics Forum | Mon Jan 19 05:02:07 EST 2015 | gertjannus
I've some troubles with LGAs components. i try to create void free results. so far i have no problems with dpacks, i think i do something wrong with the vacuum time. The padcoverage of my lga is very bad the vacuum creates solderballs under the compo
Industry News | 2011-01-05 16:07:01.0
Virtual Industries Inc. announces that it will display several advanced systems in Booth 2141 at the upcoming SPIE Photonics West exhibition, scheduled to take place January 22-27, 2011 at the Moscone Center in San Francisco.
Industry News | 2012-01-20 15:26:12.0
Virtual Industries will display several advanced systems in Booth #628 at the upcoming IPC APEX Expo.
Parts & Supplies | Chipshooters / Chip Mounters
PN:JUKI FX-3 FX-3R HEAD MAIN PCB 40047506 Head vacuum card KXFP6F97A00松下CM202 Y轴驱动器 MR-J2S-70B-EE085 KXFP6GE1A00松下CM402 X轴驱动器 MR-J2S-100B KXFP6GB0A00松下CM402 Y轴驱动器 MR-J2S-100B-EE085 N510002593AA松下CM602 X轴驱动器 MR-J2S-60B CM602 Y轴驱动器 MR-J2S-350B-S0
How to use the BULB-VAC with a vacuum cup
Heller Industries Inc. | https://hellerindustries.com/product/1913-mark-5-series-smt-reflow-oven/
& Back-end Semiconductor Pressure Curing Oven (PCO 860) Voidless / Vacuum Fluxless / Formic Acid Soldering Have a Special Application
| https://www.smtfactory.com/smt-production-lines.html
Series Vacuum Reflow Oven SMT Stencil Printing Machine Semi-auto SMT Stencil Printer Full-auto SMT Stencil Printer Pick & Place Machine SAMSUNG Pick
