Industry News | 2018-06-27 09:51:50.0
CUI today announced that it has teamed up with SnapEDA, the market-leading parts library for circuit board design, to provide designers with a catalog of free, ready-to-download PCB footprints and symbols for CUI’s range of board mount electromechanical components.
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A leading suite of powerful tools for boundary scan testing and programming based on the original JTAG standard, IEEE 1149.1. ScanNavigator harnesses the power of Acculogic’s comprehensive set of boundary scan test and on-board device programming t
Industry News | 2010-09-02 11:15:43.0
Darmstadt, Germany – Router Solutions GmbH has released Ver. 2.0 of its popular BOM ConnectorTM software program. BOM ConnectorTM is used by PCB manufacturers, particularly in the EMS sector, to better integrate ERP information into their quoting and NPI process.
Technical Innovation The first 10 bit image processing in its industry by on-the-fly vibrationless scan (High speed & high precision image acquisition) 4 times higher height measurement resolution than the existing Moire technology (The best
Industry News | 2010-06-21 14:29:09.0
MERIDIAN, IDAHO ― Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronic manufacturing services to OEMS, announces that it handles dynamic engineering changes and quickly ramps up or down to meet changing product and volume demands in order to improve customers’ inventory costs, cycle times and, ultimately, the level of customer satisfaction.
Technical Library | 2017-11-03 13:39:06.0
If someone were to ask what the most important part of their favorite electronic device is, they are likely to point to the printed circuit board (PCB) responsible for making the device work before moving on to other components. From large motherboards to tiny chips, most of the technology that retail consumers take for granted comes down to a properly installed and calibrated PCB.
Technical Library | 2019-05-01 10:07:37.0
Adhesive bonding involves the use of adhesive to form a material bond between two or more assembly parts. In addition to regular adhesive bonding applications, hybrid processes, in which the adhesive bond includes another function such as sealing or heat dissipation, are gaining importance. Traditional joining methods such as welding or bolting are progressively being replaced in industrial applications by efficient adhesive bonding processes, since these processes provide a number of advantages such as part weight reduction or simplified parts handling.
Industry News | 2013-09-17 16:08:44.0
ACD announces David Applegate’s 20-year anniversary with the company. Applegate joined ACD as a Senior Computer-Aided Manufacturing (CAM) Technician in 1993.
Technical Library | 2008-10-23 15:36:58.0
As part of continuous process improvement at KEMET, most failure modes caused by the capacitor manufacturing process have been systematically eliminated. Today these capacitor manufacturing-related defects are now at a parts per billion (PPB) level. Pareto analysis of customer complaints indicates that the #1 failure mode is IR failure due to flex cracks.