Electronics Forum | Wed Nov 10 11:21:37 EST 2004 | jmedernach
Hi Folks, Does anyone out there know the names of the manufacturers of batch style vapor phase reflow systems. I'm not interested in anything in-line. I'm looking for relatively small footprint systems. I've come across Wenesco and Sintronex. Doe
Electronics Forum | Wed Nov 10 11:21:39 EST 2004 | jmedernach
Hi Folks, Does anyone out there know the names of the manufacturers of batch style vapor phase reflow systems. I'm not interested in anything in-line. I'm looking for relatively small footprint systems. I've come across Wenesco and Sintronex. Doe
Electronics Forum | Fri Dec 03 16:00:48 EST 2010 | glenseely
When faced with high mass, high cost, sensitive PCBs and now with the added challenges of Pb-Free Vapor Phase is the only safe reflow method for component and joint integrity. A-Tek is the National Distributor for Asscon Vapor phase reflow. Asscon
Electronics Forum | Mon Feb 03 23:49:00 EST 2003 | Dreamsniper
Hi, Has anyone who's using vapor phase process able to help me troubleshoot tombstoning? I raed about uneven forces during reflow due to misalignment, pad design, paste volume deposition unevenness due to dirty stencils, worn stencil printer parts s
Electronics Forum | Thu Jan 12 20:11:25 EST 2012 | davef
Isola water pressure. Between a 210°C normal tin lead cycle and a 250°C lead-free assembly cycle, the vapor pressure doubles. Reflow temperature [*C]||Vapor pressure of water [psi] 150||100 200||225 210||260 220||320 230||400 240||480 250||580 300||1
Electronics Forum | Wed Dec 10 14:03:56 EST 1997 | Scott Cook
| I would appreciate hearing views on vapour phase soldering particularly in respect to BGA's. | I know that they used to use CFC's but apparently this is no longer the case? | Can anyone help with some info? | Thanks, Alan Brewin Alan, Unfortunately
Electronics Forum | Wed May 12 13:34:02 EDT 2010 | hegemon
Thanks Pete B - great info. I am currently preparing a DOE to address concerns about reflow of componentry on the bottomside of the PCB while in the vapor. Specifically cosmetics and part dropping. Bottom side has no flux, but will be fully reflow
Electronics Forum | Wed Jan 17 07:55:11 EST 2007 | pavel_murtishev
Vladimir, Phil J is right. Tantalum�s moisture vapor outgassing is the root of the problem you are searching for. Internal pressure of entrapped moisture becomes very high in reflow zone. Vapor jet shifts your components and affects BGA�s bumps. Bak
Electronics Forum | Sat Dec 04 18:55:38 EST 2004 | Grant
Hi, Yes, all you really need to do is boil the fluid while suspending the PCB above the vapor, so it's quite easy. However I would recommend against dropping the board direct into the vapor cloud, as that would be a very fast warm up, while letting
Electronics Forum | Fri May 07 23:43:10 EDT 2010 | jlawson
I assume you using a fixed mass vapour phase system? Yes rates of rise are impacted by the mass of the PCB, larger the mass to mass of vapour phase the lower the rise generally. So if you load the machine with very little mass PCB rise times can be
