Full Site - : vapor 2phase reflow (Page 25 of 35)

MONSTER board equipment...

Electronics Forum | Fri Aug 24 19:08:17 EDT 2001 | stefo

Happy Friday All! Well, it seems another "opportunity" has presented itself to me. Looking to assemble a 24" X 24", 52-layer board... piece-o-cake, right? Not real sure of all the components that are on it, but I do know that there is some 20-mil

Re: Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Tue Apr 18 19:37:35 EDT 2000 | Russ Cutler

Let me be more specific about my dilema. We have used a vapor phase reflow process for many years. We just bought a Heller 1800 this year (2000). We may very well be able to run all 600 very different board types we build in 10 recipies on the Hel

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Wed Mar 21 20:40:28 EST 2001 | dblsixes

We are building a monster ... Dimensions are 10" x 7" ... 12 layers ... A Logic Assembly with a Power Supply all rolled into one ... The Power Supply is in one section of the board, the logic in the other section ... The Power Supply obviously has a

Which Oven Soldering Technology ?

Electronics Forum | Thu Jul 04 00:18:10 EDT 2002 | ianchan

Hi mate, in humble opinion, Hot air Convection types are here to stay. Some machine designer folks are combining IR and Hot Air Relow into integrated technological units for commercial sale to folks like us. Dave F tells us that another group of d

High Melting Point Solder Paste

Electronics Forum | Mon Dec 28 08:51:45 EST 2009 | jax

What solder are you talking about and what reflow method are you using? High Melt Alloys: SN96 (Sn96/Ag4 or Sn96.5/Ag3.5) - Simliar to SAC305 although normally uses Rosin based flux that can required more extensive cleaning. Pb85 (Pb85/Sb10/Sn5) -

Re: Temperature profile req's for Pin In Paste process

Electronics Forum | Sat Apr 11 14:31:16 EDT 1998 | Gary Simbulan

| | I would like to invite everyone to share/discuss | | information/knowledge/experience they have with | | the req's that are assumed to be valid for the | | temperature/time relation in the process of reflow | | soldering Pin In Paste, Intrusive R

Need Expert Support - Popcorning

Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette

Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level

Reflow PBGA

Electronics Forum | Fri Jun 28 01:06:49 EDT 2002 | Dreamsniper

Hi Steve, We have a Heller 1088 (4 Zone Oven) and we are using Indium NC92 with 2% silver. My Oven setting is: Zone 1 Top & Btm 125 Zone 2 Top & Btm 145 Zone 3 Top & Btm 188 Zone 4 Top & Btm 265 Belt Speed 34 cm/min I have run a profile

cleaning PCB's

Electronics Forum | Tue Jan 10 20:39:06 EST 2006 | aqueous

Of course there are solvents which are less harmful to the environment than others. The operative phrase is �less harmful�. As a rule, water-based chemistries are �greener� than solvents. There are some solvent blends designed for aqueous-based eq

Re: N2 vs. Air Reflow Soldering

Electronics Forum | Wed Dec 20 22:24:03 EST 2000 | Greenman

Dave: In terms of heat transfer, air is 78% nitrogen, and the remainder is mostly (20.9%) oxygen (roughly the same molecular weight as nitrogen), with a bit of argon (0.9%), CO2, hydrogen, monosodium glutamate etc. So you would expect virtually no d


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