Electronics Forum | Thu Jan 27 20:34:12 EST 2000 | Dave F
Ashok: The real concern about moisture sensitivity is in plastic packaged parts. The plastic packaging used to manufacture surface mount technology devices absorb moisture from the environment. The high temperatures involved in vapor phase/reflow
Electronics Forum | Thu Sep 06 10:34:21 EDT 2001 | Mike Konrad
Hi Jeff, Sean is correct. Although ultrasonic technology will work in post-reflow de-fluxing applications, you will receive concerns regarding ultrasonic �damage� to wire bonded components. Much has been written to combat this belief but the conce
Electronics Forum | Thu Mar 28 16:00:31 EST 2002 | bschreiber
Hello Dave, Water Washable (Organic Acid, OA) post solder flux residue is designed for cleaning in plain water without cleaning chemical additives. The real advantage of water washable flux was that it cleaned in plain water without additives � no
Electronics Forum | Tue Dec 22 12:08:06 EST 2015 | aqueous
The overwhelming technology used in post-reflow cleaning of electronic assemblies is aqueous. Prior to the 1990's, solvents and vapor degreasers dominated the cleaning industry. After the popular solvents were banned via a United Nations treaty, alte
Electronics Forum | Tue Dec 29 15:21:25 EST 1998 | Ryan Jennens
| | | | I have been working on this process for a couple of weeks and I know that there are a few other companies in Europe and Japan who are also playing. | | | | | | | | Is there any one who has been running this process in production ? | | | | |
Electronics Forum | Tue Dec 29 15:45:29 EST 1998 | Earl Moon
| | | | | I have been working on this process for a couple of weeks and I know that there are a few other companies in Europe and Japan who are also playing. | | | | | | | | | | Is there any one who has been running this process in production ? | |
Electronics Forum | Fri Sep 17 06:01:12 EDT 1999 | Earl Moon
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
Electronics Forum | Wed Nov 21 12:29:52 EST 2001 | mparker
Now that we know where you've been and what you wish to accomplish next, I can still give you some suggestions. 1. Get IPC-7912. Use it to evaluate your CM's. Especially if you have multiple contractors supplying like products. You will quickly see
Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan
Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have
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