Full Site - : vapor 2phase reflow (Page 6 of 35)

IBL Technologies Provides Vapor Phase System to Lockheed Martin

Industry News | 2011-01-10 13:38:22.0

IBL Technologies LLC, a division of IBL Löttechnik GmbH, announces that Lockheed Martin has purchased an IBL BLC-609 vapor phrase system.

IBL - Löttechnik GmbH

Rehm Thermal Systems Korea Limited

Industry Directory | Manufacturer

Manufacturer of convection reflow ovens, vapor phase ovens, convection curing, and IR curing ovens.

Vapor Phase Manufacturer IBL Technologies Holds 30 Year Anniversary Event

Industry News | 2017-06-28 20:34:11.0

IBL Technologies, LLC recently held its 30-year anniversary celebration. The two-day event took place June 20-21, 2017 at the company’s Burnsville facility. The celebration honored 30 years of development of IBL’s vapor phase soldering machines as well as 20 years for R&D VaporTech.

IBL - Löttechnik GmbH

IBL Technologies Offers Special Pricing on SLC509 Vapor Phase Soldering Demo Units

Industry News | 2016-10-06 10:36:22.0

IBL Technologies, LLC today announced a special offer on its SLC509 demo units. A limited quantity of reflow vapor phase soldering systems are available for a low price of $49,950.00 through December 31, 2016 (or while supplies last). The demo units have less than 20 hours of operation.

IBL - Löttechnik GmbH

R&D Technical Services� RD52 Inline Vapor Phase Reflow Oven Named as a VISION Award First Finalist

Industry News | 2008-04-08 22:16:26.0

BURNSVILLE, MN � April 2, 2008 � R&D Technical Services Inc., the leader in the vapor phase equipment market, announces that its RD52 Inline Vapor Phase Reflow Oven was named as a first finalist in the Soldering Equipment category during the VISION Awards announcement ceremony that took place Wednesday, April 2, 2008 in Las Vegas during APEX 2008.

R&D Technical Services, Inc.

R&D Technical Services Announces Increased Sales

Industry News | 2009-01-21 19:53:39.0

BURNSVILLE, MN � January 2009 � R&D Technical Services Inc. announces double digit growth in sales over 2007. This increase is due in part to the Vapor Rework Station and increased business in the motherboard and back panel industry.

R&D Technical Services, Inc.

How to Manage Material Outgassing in Reflow Oven

Technical Library | 2020-11-24 23:12:27.0

In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-paste technology also increase solder paste use. More components and more solder paste result in more outgassing of chemistry during the reflow process. Some assemblies report condensation of vapors when the cold printed circuit board enters the oven. Little is known about the interaction between these condensed materials in terms of the interaction between these condensed materials and the reliability of the assembly. Apart from the question of reliability, a printed circuit board contaminated with a small film of residues after reflow soldering is not desirable.

Vitronics Soltec

R&D Technical Services Appoints Illinois and Wisconsin Representatives

Industry News | 2009-09-26 15:31:28.0

BURNSVILLE, MN — September 2009 — R&D Technical Services Inc., the leader in the vapor phase equipment market, announces that it has named Hattas and Associates and Technology Plus as representatives for Illinois and Wisconsin.

R&D Technical Services, Inc.

Reflow Vapor Phase Soldering from IBL Technologies at APEX

Industry News | 2020-01-06 16:12:56.0

IBL Technologies, LLC today announced plans to showcase its BLC 420 Batch Soldering Machine in Booth #2822 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California.

IBL - Löttechnik GmbH

Going Lead Free With Vapor Phase Soldering - Lead Free Is Still a Challenge For Major Industries.

Technical Library | 2014-01-30 18:08:04.0

As of today, the electronic industry is aware of the requirements for their products to be lead free. All components are typically available in lead free quality. This comprises packages like BGAs with BGA solder balls to PCB board finishes like HASL. The suppliers are providing everything that is needed. It is harder to get the old tin leaded (SnPb) components for new applications today, than lead free ones. So why has not everybody changed over fully yet and how can the challenges be overcome? A big concern in this transition process is reflow soldering. The process temperatures for lead free applications became much higher. Related with this is more stress for all the components. It affects the quality and reliability of the electronic units and products...

IBL - Löttechnik GmbH


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