Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
Industry News | 2017-09-15 11:41:47.0
Solderstar, a leading provider of thermal profiling equipment for the Electronic Manufacturing sector, will showcase its innovative range of intelligent dataloggers and measurement products at the forthcoming SMTA 2017 exhibition, held in Rosemont, IL. A full range of equipment will be available at the booth for demonstration, including the Solderstar PRO range of profiling tools which help streamline the whole profiling operation for reflow ovens, wave/selective soldering machines and the vapor phase process. The latest version of Profile Central – Solderstar’s reflow profiling analysis software will also be available for demonstration providing many new features.
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Equipment Broker - Used - SMT specialists - Quality Manufacturing Equipment Bought and Sold - Zevatech/Juki /MPM Specialists.
Industry News | 2021-12-03 07:24:48.0
Following a successful European show at Productronica in Germany, Solderstar a leading supplier of profiling equipment for reflow, wave, vapor and selective soldering, is ready to present its latest innovations to the North American region when they attend IPC Apex Expo, in San Diego, California from 25-27 January 2022, booth 1205.
NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for
New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2021-12-03 07:22:29.0
Clearwater, Florida: Productronica will be used as the launch pad for Solderstar's game-changing new datalogger, SLX. The innovative thermal profiler has been designed for operation with zero measurement setup, so it is instantly ready to use making the process of data capture quick and easy. As a leading supplier of temperature profiling equipment for reflow, wave, vapor and selective soldering, Solderstar will introduce the new product at their booth A4.240 during the exhibition held from 16-19 November, 2021 in Munich, Germany.
