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Re: Simultaneous Double Sided Reflow

Electronics Forum | Tue Dec 29 10:36:38 EST 1998 | Earl Moon

| I have been working on this process for a couple of weeks and I know that there are a few other companies in Europe and Japan who are also playing. | | Is there any one who has been running this process in production ? | | Yes I do mean reflowing

Re: Simultaneous Double Sided Reflow

Electronics Forum | Tue Dec 29 12:18:17 EST 1998 | Ryan Jennens

| | I have been working on this process for a couple of weeks and I know that there are a few other companies in Europe and Japan who are also playing. | | | | Is there any one who has been running this process in production ? | | | | Yes I do mean

Reflow of SMT Glue / Adhesives

Electronics Forum | Tue Jun 17 01:27:25 EDT 2003 | Dreamsniper

Hi Guys, I need your opinion here. Has anyone tried doing this Process: Bottomside Process first which means gluing the chip components then reflowing the Glue instead of Curing them, then Topside process which is solder paste printing then compone

Accuracy Requirements for New Technology

Electronics Forum | Fri Apr 08 16:26:36 EDT 2005 | Grant

Hi, It seems weird that an automated pick and place machine at a board shop would not be up to NASA standards, but placing the components by hand would be. However most SMT will self center a bit, so if your close enough, you should be ok. You rea

Reflow Oven Selection

Electronics Forum | Wed Aug 31 10:26:24 EDT 2005 | Carmichael

I respectfully disagree with vapor phase or reflow oven being the technology of choice here. Have you considered straight conduction heating? (ie: hot plate) If you have a lot of these to do you can purchase in-line conduction ovens like the Sikama o

Recommended Reflow Benchtop Oven

Electronics Forum | Fri Aug 30 03:59:18 EDT 2013 | spoiltforchoice

For "Production" none of the above or any of this type. These little batch oven are for small labs and prototyping houses, even the best ones have only limited control over the reflow process. None of them are intended for the repeated serial use you

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Fri Mar 17 21:38:55 EDT 2017 | jlawson

I think the main driver is MTBF data driven by the Car OEMS, mainly german makers pushing this onto suppliers in supply chain. Vacuum soldering and void reduction is a hot topic for the leading electronics suppliers in Germany at the moment. Is not r

No such thing as a Compact Reflow Oven?

Electronics Forum | Sun Mar 18 18:01:00 EDT 2018 | spoiltforchoice

Reckless that's easy : Tabletop units are a joke, you could just as well go build one yourself with a toaster oven and a controller, the results won't be great but at least you won't have spent $5k on one with a ssnazzy screen. "Hulking Units" - wel

No such thing as a Compact Reflow Oven?

Electronics Forum | Mon Mar 19 09:37:01 EDT 2018 | spoiltforchoice

Another critical part of a process with a large board is support. Most commonly this is a bed of pins e.g something like red-e-set but there are other solutions. Support with a large panel will be critical for printing to get a good gasket between PC

Re: Temperature profile req's for Pin In Paste process

Electronics Forum | Sat Apr 11 14:31:16 EDT 1998 | Gary Simbulan

| | I would like to invite everyone to share/discuss | | information/knowledge/experience they have with | | the req's that are assumed to be valid for the | | temperature/time relation in the process of reflow | | soldering Pin In Paste, Intrusive R


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