Industry Directory | Manufacturer
Manufacturer of vapor phase soldering systems and associated products since 1985.
Industry Directory | Manufacturer
R&D Technical Services was formed in 1996 to support the Vapor Reflow market and is currently the leading source of Vapor Phase equipment.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
Electronics Forum | Mon Jul 19 11:50:47 EDT 1999 | Mario
| | Hi, SMTASSY | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | First, we do not do real series produktion, only prototyping up to sometimes 20 uni
Electronics Forum | Mon Jul 19 12:37:15 EDT 1999 | Wolfgang Busko
| | | | | Hi, SMTASSY | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | First, we do not do real series produktion, only prototyping up to som
Used SMT Equipment | Pick and Place/Feeders
YAMAHA placement machine-YV180Xg equipment parameters: Theoretical mounting speed: 0.095 seconds/CHIP, actual 20000CHIP/H. Production PCB size: L330 x W330 ∼ L50 x W50mm / t = 0.4 ∼ 3.0mm. SMD components range: 0402∼SOP, SOJ, 84 Pin
Used SMT Equipment | General Purpose Equipment
Very Nice Thermotron Test Chamber For Sale Equipment Description Thermotron Model Number: ESS-30 Serial Number: 460/16739RF Year 2003 15 HP Motor Compressor 1 - R23 @ 6 lbs. Compressor 2 - R507 @ 12 lbs. (4) Lambda
Industry News | 2011-08-08 16:18:31.0
The SMTA announced that the Contract Manufacturing Symposium will be held on October 18, 2011 as a focused symposium at SMTA International in Ft. Worth, TX. The symposium, aimed at OEMs, and EMS program managers and executives, looks at risk mitigation strategies from Asia to Eastern Europe, and selected SMT processing solutions that could benefit those companies grappling with RoHS and other environmental or leading-edge (high BGA pin count) technical issues.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Parts & Supplies | Pick and Place/Feeders
Ever since the first day of establishment, Qinyi Electronics Co.,Ltd has play the role of SMT industrial solution provider, it serve customer from domestic and oversea, with good quality production and service, with its commitment to"Product, honesty
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Parts & Supplies | Soldering - Reflow
This reflow oven is top quality oven represent the world's best low cost, high performance solder reflow sytem. The sensor is designed in the front of tip and the temperature induction is very exact and sensitive, the speed of heating and recovery of
Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 2021-06-15 15:17:33.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Nano-copper sintering in formic acid vapor.
The Centurion™ is a forced-convection SMT reflow system with tight, closed-loop process control, built for today’s high-throughput PCB assembly environments. With the best heat transfer in the industry, the Centurion is able to run any profile at the
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 1 of 3)
Career Center | Longmont, Colorado USA | Engineering,Maintenance,Technical Support
FIELD SERVICE ENGINEER I JOB DESCRIPTION A-Tek Systems Group is an electronics equipment distributor specializing in factory automation – specifically with depaneling, vapor phase soldering, selective soldering and cleaning. A-Tek is headqu
Career Center | Loves Park, Illinois USA | Engineering
EDUCATION REQUIRED: B.S. Degree in Electrical Engineering or equivalent. EXPERIENCE REQUIRED: Minimum of five years experience in all phases of development, design, manufacturing, and application engineering, or equivalent. SUMMARY STATEMENT: Pl
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
SMTnet Express, March 20, 2014, Subscribers: 22559, Members: Companies: 13833, Users: 35907 Today's Vapor Phase Soldering. An Optimized Reflow Technology for Lead Free Soldering. Dipl.-Ing. Helmut Leicht; Andreas Thumm; IBL-Löttechnik Gmb
Lewis & Clark | https://www.lewis-clark.com/product/baron-blakesee-mlr-216le-precision-vapor-degreaser/
: Baron Blakeslee Model: MLR-216LE Description: Precision Vapor Degreaser Details: Volts: 230v Circuit Amps: 35A Phase Cycle: 1/60 Primary Refrigerant
| https://www.feedersupplier.com/sale-13240943-original-new-offline-spc-single-phase-220v-smt-spi-machine.html
Original New Offline SPC Single Phase 220V SMT SPI Machine Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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