Industry Directory | Manufacturer
R&D Technical Services was formed in 1996 to support the Vapor Reflow market and is currently the leading source of Vapor Phase equipment.
Industry Directory | Manufacturer
Manufacturer of vapor phase soldering systems and associated products since 1985.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Ersa HOTFLOW 3/20 SMT Reflow Oven Working width: 45-580 mmProcess length: 5,190 mmHeated length: 3,700 mmCooling length: 1,490 mmWeight appr. 3,200 kgDimension: 6,590x1,530x1,450 mm Ersa HOTFLOW 3/20 SMT Reflow Oven Ersa HOTFLOW 3/20 SMT Refl
Electronics Forum | Wed Nov 17 09:28:40 EST 1999 | Steve Z
Hello, I am new to the SMT area and I need to know what a "good" vapor phase reflow profile should look like. The fluids we are using have a BP of 45 C and 219 C. Thanks,
Electronics Forum | Fri Nov 19 05:12:21 EST 1999 | Graham Naisbitt
Steve, If you can get me your snail-mail address, I will send you some latest information. We actually have a totally new system called Delta 5. It is Condensation Soldering rather than Vapour phase, the difference being that we solder in an air ti
Used SMT Equipment | Soldering - Reflow
1997 Electrovert OMNI 7 Reflow Oven Left to Right 7 Heating Zones (Top & Bottom Heaters) Edge & Mesh Transport Power: 480 VAC; 101.2A; 60Hz; 3 Phase Machine Dimensions: 194" x 54" x 56" Serial: 11871242
Used SMT Equipment | Soldering - Reflow
2004 BTU Pyramax 150N X5 Reflow Oven 10 Zones (Top and Bottom Side Heaters) 2 Cooling Zones Edge Rail & Mesh Belt 7819 Operating Hours Nitrogen Capable Power: 380 / 220VAC; 3 Phase; 119A Machine Dimensions: 260" x 60" x 65"
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2018-10-18 09:14:05.0
Lead-free processes propose new requirements on reflow soldering quality
Parts & Supplies | Assembly Accessories
AXPC fan Assembly 949839603998 0.8M Linking Conveyor, Single Lane, for Cooling, with 6 Fan on Top MMLC-2103.8F 0.8m Linking Conveyor, without Fan MMLC-2103.8 1KURA FAN （for Samsung Reflow SRF70i82 ） U6250MKG1 1M Conveyor With
Technical Library | 2014-03-20 12:37:39.0
In the beginning of SMT, Vapor Phase Soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities. There were also some disadvantages like fast temperature rise, nearly no influence on the temperature profiles and high costs. So the use of Vapor Phase Soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace use).
Technical Library | 2013-03-27 23:43:40.0
Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase.
Nano-copper sintering in formic acid vapor.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Longmont, Colorado USA | Engineering,Maintenance,Technical Support
FIELD SERVICE ENGINEER I JOB DESCRIPTION A-Tek Systems Group is an electronics equipment distributor specializing in factory automation – specifically with depaneling, vapor phase soldering, selective soldering and cleaning. A-Tek is headqu
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published
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Original New Offline SPC Single Phase 220V SMT SPI Machine Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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