Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Industry News | 2010-02-17 18:45:59.0
The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.
Industry News | 2009-03-12 18:25:36.0
The SMTA International Technical Committee invites you to submit an abstract for the 2009 conference. Short course descriptions are also being solicited.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Parts & Supplies | SMT Equipment
Yamaha Mini Steel YV64D Yamaha Dispenser Nozzle YV64D series nozzles: 1 K37-M7113-20X YV86/YV100D DISP.NZ. 1D/1S(FOR SOLDER PASTE) 2 K37-M7113-10X YV86/YV100D DISP.NZ. 1D/1S(FOR ADHESIVE) 3 K37-M7113-00X YV86/YV100D DISP.NZ. 2D/1S(FOR ADHESIVE)
Parts & Supplies | SMT Equipment
Yamaha Mini Steel YV64D Yamaha Dispenser Nozzle YV64D series nozzles: 1 K37-M7113-20X YV86/YV100D DISP.NZ. 1D/1S(FOR SOLDER PASTE) 2 K37-M7113-10X YV86/YV100D DISP.NZ. 1D/1S(FOR ADHESIVE) 3 K37-M7113-00X YV86/YV100D DISP.NZ. 2D/1S(FOR ADHESIVE)
The Centurion™ is a forced-convection SMT reflow system with tight, closed-loop process control, built for today’s high-throughput PCB assembly environments. With the best heat transfer in the industry, the Centurion is able to run any profile at the
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Technical Library | 2019-10-21 09:58:50.0
An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).
