Electronics Forum | Tue Aug 18 16:32:25 EDT 2009 | ldavis
Sergey, Try increasing the cool down time if that is a recipe option. We have witnessed the same effect on components that have rather slow cool down rates and were able to eliminate the problem by extending the cooling time.
Electronics Forum | Thu Aug 20 04:37:03 EDT 2009 | sergey2007
Hi, I also paid attention on the solder balls.. I thought it was because of the pop-corning, but the customer told me the component was not damaged.. Regarding the bunch of tented vias, I need to ask the customer about that. Probably, they have unpo
Electronics Forum | Wed Aug 19 01:00:13 EDT 2009 | sergey2007
Hi! Thanks to everyone! Josh, I don't think it could be something wrong with the mechanics, as just one component was rotated. Anyway, we will check the mechanical parts of the oven. LarryD, thank you for the advice. But what is the physics of the
Electronics Forum | Tue Aug 25 10:38:03 EDT 2009 | grahamcooper22
Hi Sergey, Do you know the Moisture Sensitivity Level of the component ? This is normally recorded on the DRY PACK that the device comes in. It is not unusual for a device to POP CORN and still work in test. It depends how much damage there is to th
Electronics Forum | Wed Aug 26 03:21:00 EDT 2009 | sergey2007
Hi Graham, the MSD level of the component is 3. I am not sure that my customer properly stored the component before the soldering process. And I am not sure that it was dried at all. The customer says they did everything that they had to, but I just
Electronics Forum | Tue Aug 18 02:10:14 EDT 2009 | sergey2007
Hello, I have a customer who recentely installed a vapor phase soldering system. Everything goes pretty well, but from time to time the customer has the same problem with the soldering: one of the components on PCB (usually, it's a QFP package) is ro
Electronics Forum | Wed Aug 19 18:28:01 EDT 2009 | ratsalad
I'd like to ask a question. Have you determined where all those solder balls are coming from? I even see them on top of U40 and U15. This seems like a dumb question to me considering the size of the part (and having seen pictures of only one boa
Electronics Forum | Thu Aug 20 18:20:21 EDT 2009 | joeherz
Sergey, With that many leads and contact surface area points, it doesn't make sense that the part would move as it has without a gust of wind.... What is your confidence that you don't have an MSD issue on this part. Being that it is a TQFP, it's
Electronics Forum | Wed Aug 26 05:22:59 EDT 2009 | grahamcooper22
Hi Sergey, I agree with your probable cause. Maybe if you still have a component you can bake it before reflow to DRY it. Then if the problem doesn't happen in reflow you have surely proved the cause. Consult IPC JEDEC 33B spec for storage and Drying
Electronics Forum | Thu Aug 20 08:23:23 EDT 2009 | ratsalad
One diagnostic tool that I have found useful in the past is the "hot plate test". Place suspect components and/or PCB's on a hot plate and turn it on High. Then observe. Granted the conditions on the hot plate are not the same as in a reflow oven,
