Industry Directory | Manufacturer
Melbourne-based surface mount electronics assembly for any size job, including prototypes; design for manufacture advice. We use 100% green energy.
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On site and online Training and consultancy in electronics manufacture. Wide range of training products which are solder worldwide by IPC, SMTA, SMART Group and others
One of three Interactive CD-ROMs developed for Soldertec Global by Bob Willis to assist engineers with the practical introduction of lead-free materials and processes. Introduced by Kay Nimmo, Technical Director, Tin Technology, the CD provides a ste
New Equipment | Education/Training
All Bob Willis training workshops are run on site at your manufacturing facility, conference or exhibition venues Worldwide. We offer the largest range of theory and hands on workshops in the industry. The content of any workshop may be modified to s
Electronics Forum | Wed Jun 16 15:39:15 EDT 2010 | mikesewell
Keep in mind you'll still need to preheat the assembly to properly activate the flux/drive off volatiles in the paste. Perhaps a convection toaster oven... Add some cooling coils and a freeboard/tube to the top of your pasta cooker or turkey fryer t
Electronics Forum | Fri Jul 16 15:30:22 EDT 1999 | SMTASSY
Perhaps a little hard to find but is there anyone who uses a vapor phase process to solder populated card with BGAs. I am interested in the success rate of such a process. It is obvious that the throughput is reduce vs a convection oven but still thi
Industry News | 2011-03-17 16:52:47.0
Rehm Thermal Systems is preparing to showcase its advanced thermal technologies at this year’s Apex exhibition, being held in Las Vegas from 12th – 14th April. As the only single source for convection and condensation soldering systems, Rehm will be demonstrating its unique capabilities from Booth 635.
Industry News | 2022-09-26 06:44:01.0
The rising cost of energy is putting a strain on everyone, including those within the electronics industry. As wholesale gas and electricity prices continue to rise, finding solutions to reduce consumption is now a top priority for companies.
Technical Library | 2019-07-23 22:33:47.0
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.
Welcome to this Defect of the Month video on simple solderability testing, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years th
Welcome to this Defect of the Month video on via hole failures and how to see them, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
—No Vacuum vs. Vacuum on QFN (<1% voids) Comparison of Conventional Convection Reflow With Vapor Phase Soldering One area we would like to discuss is a comparison of conventional convection reflow with vapor phase soldering
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
feeders, so solder wire is used, reducing the cost of simple preforms Back in the day the presenter used preforms with vapour phase and hot air guns for feed through capacitors, wire wrap back planes, heat shields and cable forms. Welcome to the interesting
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