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Agilent E4432B-UN8

Agilent E4432B-UN8

Used SMT Equipment | In-Circuit Testers

15 variations of FSK, MSK, PSK, and QAM), AM, FM, phase modulation, pulse modulation, and step/list sweep (frequency and power) E443xB Signal Studio software personalities (Bluetooth, 1xEV-DO) E443xB firmware personalities (3GPP W-CDMA, cdma2000, IS-

Test Equipment Connection

Agilent E4432B-H99-UND

Agilent E4432B-H99-UND

Used SMT Equipment | In-Circuit Testers

15 variations of FSK, MSK, PSK, and QAM), AM, FM, phase modulation, pulse modulation, and step/list sweep (frequency and power) E443xB Signal Studio software personalities (Bluetooth, 1xEV-DO) E443xB firmware personalities (3GPP W-CDMA, cdma2000, IS-

Test Equipment Connection

Agilent E4432B-UND-UN5

Agilent E4432B-UND-UN5

Used SMT Equipment | In-Circuit Testers

15 variations of FSK, MSK, PSK, and QAM), AM, FM, phase modulation, pulse modulation, and step/list sweep (frequency and power) E443xB Signal Studio software personalities (Bluetooth, 1xEV-DO) E443xB firmware personalities (3GPP W-CDMA, cdma2000, IS-

Test Equipment Connection

Agilent E4432B-UND-UN5

Agilent E4432B-UND-UN5

Used SMT Equipment | In-Circuit Testers

15 variations of FSK, MSK, PSK, and QAM), AM, FM, phase modulation, pulse modulation, and step/list sweep (frequency and power) E443xB Signal Studio software personalities (Bluetooth, 1xEV-DO) E443xB firmware personalities (3GPP W-CDMA, cdma2000, IS-

Test Equipment Connection

Agilent E4432B-H99-UND

Agilent E4432B-H99-UND

Used SMT Equipment | In-Circuit Testers

15 variations of FSK, MSK, PSK, and QAM), AM, FM, phase modulation, pulse modulation, and step/list sweep (frequency and power) E443xB Signal Studio software personalities (Bluetooth, 1xEV-DO) E443xB firmware personalities (3GPP W-CDMA, cdma2000, IS-

Test Equipment Connection

Fast Generation of production-oriented AOI Programs

Industry News | 2011-02-26 15:11:29.0

The newest version of GOEPEL electronic's AOI system software features a special highlight. An integrated debug statistics captures AOI relevant variations in the production process and provides them for statistical evaluations.

GOEPEL Electronic

Effect Of Squeegee Blade On Solder Paste Print Quality

Technical Library | 2010-06-17 20:48:04.0

The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing processes, solder paste printing is subject to both special and common cause variation. Just like using graduated cylinders from distinctly different manufacturing processes to measure a volume of liquid, using different blades types can contribute significant special cause variation to a process. Understanding the significant differences in print performance between blade types is an important first step to establishing a standard blade for an SMT process.

Speedline Technologies, Inc.

Embedding Passive and Active Components: PCB Design and Fabrication Process Variations

Technical Library | 2016-06-16 15:29:31.0

Embedding components within the PC board structure is not a new concept. Until recently, however, most embedded component PC board applications adapted only passive elements. The early component forming processes relied on resistive inks and films to enable embedding of resistor and capacitors elements. Although these forming methods remain viable, many companies are choosing to place very thin discrete passive components and semiconductor die elements within the PC board layering structure. In addition to improving the products performance, companies have found that by reducing the component population on the PC board's surface, board level assembly is less complex and the PC board can be made smaller, The smaller substrate, even when more complex, often results in lower cost. Although size and cost reductions are significant attributes, the closer coupling of key elements can also contribute to improving functional performance.This paper focuses on six basic embedded component structure designs described in IPC-7092.

Vern Solberg - Solberg Technical Consulting

Modeling And Optimizing Wire Harness Costs For Variation Complexity

Technical Library | 2018-04-25 15:54:52.0

An automotive wire harness rarely has just a single part number that can be ordered and installed in a vehicle. Typically, there are many different versions of the same harness based on the orderable content in the vehicle. These versions (often called harness levels) will have unique part numbers. The quantity of these levels and their content is what is typically called complexity and it has a significant impact on the cost of the harness.Quantifying these costs is often very difficult especially with manual methods of deriving and costing the complexity solution. Therefore, traditionally, harness costing has focused on the piece cost of each harness level. When these complexity related costs are considered it is typically with overly simplified cost modeling techniques.This paper will focus on the quantification of these complexity related costs so that they can be modeled allowing automated algorithms to optimize for these costs. A number of real world examples will be provided as well. Since no two businesses are alike, it is the aim of this paper to provide the foundational knowledge and methodology so the reader can assess their own business to model how variation complexity costs affect their business.

Mentor Graphics

INLAYS, OVERLAYS, THRULAYS, EDGELAYS,CONTACT MATERIALS

New Equipment |  

The combinations and variations of our product are limited only by the designers imagination. We can clad from 2 to 7 layers of materials together. We can inlay strips of material within other materials up to 4 across the width. (top and bottom)

CLAD METAL SPECIALTIES, INC.


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