Industry News | 2019-02-19 19:38:20.0
PCB Technology Trends 2018, a new global study published by IPC is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2023 that will affect the whole industry.
Used SMT Equipment | Screen Printers
DEK mod. HORIZON 02i Screen Printer, ser. 286085, 230V 50/60Hz, 06 Full Load Amps, 5-8 Bar Compressed Air Pressure, yr. 2005DEK mod. HORIZON 02i, ser. 286085, 230V 50/60Hz, 06 Ampères à pleine charge, 5-8 Bar de pression d'air comprimé, année 2005.Yo
Used SMT Equipment | Soldering - Wave
Model: 6622CC Vintage: 2006 Details: • Windows 7 operating system • Lead Free capable (was running lead, and will need tin wash). • 18” max width adjust • Measured Values Read-out of Frequency controlled motors on PC screen • 400V / 3 Phase
Technical Library | 2019-05-21 17:38:55.0
Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).
Technical Library | 2020-12-07 15:26:06.0
Temperature cycling testing is a method of accelerated life testing done to PCCs that are exposed to normal operation temperature variations over its lifetime. During the testing, intermittent "open" failures can first occur at the hot and cold extremes of the test, exposing weaknesses in the design and assembly. A poor/weak solder joint fatigues, a via trace or barrel cracks, loose connections or a component fails all causing an intermittent open. When not at extreme temperatures, the PCC assembly relaxes, the "open" closes creating electrical connectivity. If you are monitoring the PCC under test in-situ you will know that an intermittent failure has occurred, and the test could be stopped for inspection. If in-situ monitoring was not implemented, you would not know if there were intermittent failures or not. The PCC gets powered up and works fine at room temperature.
Industry News | 2021-06-30 04:28:57.0
Increases process capacity for large PCB panels by more than 54% with only 2% increase in footprint
Events Calendar | Tue Jun 27 00:00:00 EDT 2023 - Tue Jun 27 00:00:00 EDT 2023 | ,
Ontario Chapter Technical Webinar: Assembly & Rework: High-Speed Press-Fit Connectors
Events Calendar | Mon Feb 19 00:00:00 EST 2024 - Mon Feb 19 00:00:00 EST 2024 | ,
SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board
Events Calendar | Thu Feb 01 00:00:00 EST 2024 - Thu Feb 01 00:00:00 EST 2024 | Houston, Texas USA
Houston Chapter Hybrid Event: Increasing your Trade Show ROI
Events Calendar | Wed Mar 13 00:00:00 EDT 2024 - Wed Mar 13 00:00:00 EDT 2024 | ,
SMTA Technical Webinar: Translating the Technology, a "Cross-Over" Event - High Reliability
