Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam
HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/bubbles-and-conformal-coating
. Let’s take a look at the IPC standards. IPC Standards IPC-HDBK-830 – Long Term Reliability and Testing Section 12.1.5 – Bubbles The presence of bubbles in a conformal coating is a factor in air entrapment, outgassing, mixing and/or application methods
Heller Industries Inc. | https://hellerindustries.com/low-void-curing/
Low Void Curing - Heller Home » Low Void Curing Void Free Curing with Pressure Today’s increasing durability and reliability standards are making void free curing a necessity
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