Electronics Forum | Fri Aug 06 03:21:56 EDT 2004 | ram
What will be the impact on the plating if the moisture outgas thru the PTH?Can the plate get damaged?
Electronics Forum | Wed Apr 21 14:38:38 EDT 1999 | Justin Medernach
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
Electronics Forum | Thu Nov 14 09:24:07 EST 2002 | joconnell
What about when debugging the board I recently saw a case where we damaged a board between - 5-10 cycles of the fixture It's a catch 22 - where you need high force probes to breal the OSP - but the copper is hard surface, not like the solder HASL a
Electronics Forum | Mon Jan 18 20:51:29 EST 1999 | Dave F
| Can anyone recommend ways of reducing damage to solder masks ... a new wick perhaps. I find that using standard wicks the imposed damage is un-acceptable. | | Also any good links on the subject of bga rework would be really appreciated | | in ear
Electronics Forum | Wed Sep 15 22:52:58 EDT 2004 | pdeuel
We had same problem. Solder balls appeared on top side of board and led to damaged second side stencles. We worked around problem by running blank boards thru oven and inspecting and removing solder before processing boards with parts.
Electronics Forum | Thu Nov 14 05:45:51 EST 2002 | Jon O'Connell
Has anyone had experiences of ICT test fixtures actually damaging the PCB boards - typically when they have moved away from HASL finish to OSP. I would also like to hear more about any specific issues seen at ICT for non HASL pcb finishes thanks -
Electronics Forum | Wed Nov 07 17:11:14 EST 2001 | davef
1 CAN WAVE SOLDER AFFECT OR DAMAGE BGA? Sure. Since you are vague, assuming: * Partially assembled board was not stored to prevent moisture absorption. * BGA is in a plastic package. * Partially assembled board was stored long enough to exceed th
Electronics Forum | Wed Jul 20 15:05:28 EDT 2005 | Fred M.
With the new rev D release of IPC-A_610 came a new section 10.2.9.3 which identifies a via (through hole) with nicks along the inside of the annular ring. Defect is all three classes and states "Damage to conductor or lands". We have for years defa
Electronics Forum | Tue Nov 30 16:50:20 EST 1999 | Dave F
Greg: It depends on the specifics of the flux you are using. You didn�t say. Generally, using a: � "No-clean flux" should create no flux entrapment problems for most applications. � RMA with 25% or more solids as a "no-clean" should create no flu
Electronics Forum | Wed Feb 23 20:25:17 EST 2000 | Chris Wallace
Like all who post messages here, I'm looking for a little bit (well, maybe a lot of bit) of help. We're currently going through a redesign of a board which will utilize several FPGAs. The manufacturer (Xilinx) recommends using solder mask defined p
