Full Site - : via holes tent busters (Page 3 of 6)

BGA Via Tenting

Electronics Forum | Fri Jan 21 16:50:33 EST 2005 | Board House

I work for a board house and our proceedure for this process is the following, We cover the via pads leaving the hole open and then apply the surface finish and then go back and Cover the Via with a second operation. By doing this you do not entrap

Tenting via(s) under BGA & CSP?

Electronics Forum | Mon Apr 22 15:05:47 EDT 2002 | tim_easterling

Depending on the volume of boards you are manufacturing, the most cost effective solution would be to epoxy plug the vias prior to LPI soldermask application. The technique is common practice and most suppliers can provide it will little or no cost a

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Fri Dec 01 15:22:46 EST 2017 | kojotssss

Recommended land and solder pattern says: VIA wall plating, via holes should be tented with solder mask on the backside and filled with solder. Solutions at this moment ? Thanks for all :)

QFN voiding levels

Electronics Forum | Tue Jun 15 22:31:06 EDT 2010 | Mag10

Depending on the how you plug the via, the void level can significantly affected. If you have via plugged from the bottom side; i.e. opposite side of the component, you will see alot of void due to entrapped air in the via hole. I found work best wh

Tented Via's

Electronics Forum | Wed Feb 20 16:52:11 EST 2008 | pms

Yea, I'm still here.....sigh. Got bridging problems. These assemblies are SMT topside, then go thru wave for thru-hole components on topside. These assemblies have many, many, many vias VERY close together. We have a problem with solder from the wa

Tented Via's

Electronics Forum | Fri Feb 22 14:22:07 EST 2008 | stevek

Are you using nocleans, especially when you get to SMT? Years ago, I had OA wave flux get into vias that were plugged from the top under parts. It is really difficult to clean small, high aspect ratio vias. Cross sections showed that the copper in

QFN PCB Pad no Drain Hole

Electronics Forum | Sat May 18 15:19:55 EDT 2013 | isd_jwendell

OK, I've now read all of the documents you referenced. The problem still remains regarding the thermal vias and how to minimize scavenging. All the docs acknowledge top and bottom tenting, and it's problems. TI says don't do it. Plugging is usually n

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Pad Design

Electronics Forum | Mon Apr 16 12:31:27 EDT 2001 | mparker

If, after all the good advice already given, the engineer insists on following his wacky design, you may still be able to influence some success. First you have the fab house plug the via holes with solder then you make sure that the bottom side of


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