Electronics Forum | Fri Dec 01 15:22:46 EST 2017 | kojotssss
Recommended land and solder pattern says: VIA wall plating, via holes should be tented with solder mask on the backside and filled with solder. Solutions at this moment ? Thanks for all :)
Electronics Forum | Tue Jun 15 22:31:06 EDT 2010 | Mag10
Depending on the how you plug the via, the void level can significantly affected. If you have via plugged from the bottom side; i.e. opposite side of the component, you will see alot of void due to entrapped air in the via hole. I found work best wh
Electronics Forum | Wed Feb 20 16:52:11 EST 2008 | pms
Yea, I'm still here.....sigh. Got bridging problems. These assemblies are SMT topside, then go thru wave for thru-hole components on topside. These assemblies have many, many, many vias VERY close together. We have a problem with solder from the wa
Electronics Forum | Fri Feb 22 14:22:07 EST 2008 | stevek
Are you using nocleans, especially when you get to SMT? Years ago, I had OA wave flux get into vias that were plugged from the top under parts. It is really difficult to clean small, high aspect ratio vias. Cross sections showed that the copper in
Electronics Forum | Sat May 18 15:19:55 EDT 2013 | isd_jwendell
OK, I've now read all of the documents you referenced. The problem still remains regarding the thermal vias and how to minimize scavenging. All the docs acknowledge top and bottom tenting, and it's problems. TI says don't do it. Plugging is usually n
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Mon Apr 16 12:31:27 EDT 2001 | mparker
If, after all the good advice already given, the engineer insists on following his wacky design, you may still be able to influence some success. First you have the fab house plug the via holes with solder then you make sure that the bottom side of
Electronics Forum | Fri Jul 09 16:32:35 EDT 1999 | John
Thanks everyone. I appreciate the help. John | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | Q #2) When speaking of annular
Electronics Forum | Tue Dec 14 01:05:09 EST 1999 | cklau
Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? Ans: Fur inner layers Min = .006" hole-pad annular ring ; inner pad dia - hole dia/2 For outer layers Min = .005" hole-pad annular ring ; outer p
